ZHCSSV3 August   2023 SN74HC165B-EP

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements, VCC = 2 V
    7. 6.7  Timing Requirements, VCC = 4.5 V
    8. 6.8  Timing Requirements, VCC = 6 V
    9. 6.9  Switching Characteristics, VCC = 2 V
    10. 6.10 Switching Characteristics, VCC = 4.5 V
    11. 6.11 Switching Characteristics, VCC = 6 V
    12. 6.12 Operating Characteristics
    13. 6.13 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced CMOS Push-Pull Outputs
      2. 8.3.2 Latching Logic
      3. 8.3.3 Clamp Diode Structure
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Power Considerations
      2. 9.2.2 Input Considerations
      3. 9.2.3 Output Considerations
      4. 9.2.4 Detailed Design Procedure
      5. 9.2.5 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Mechanical, Packaging, and Orderable Information

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订购信息

6.4 Thermal Information

THERMAL METRIC(1)

SN74HC165B-EP

UNIT

PW (TSSOP)

16 PINS
RθJAJunction-to-ambient thermal resistance

131.2

°C/W
RθJC(top)Junction-to-case (top) thermal resistance

69.4

°C/W
RθJBJunction-to-board thermal resistance

75.8

°C/W
ψJTJunction-to-top characterization parameter

21.0

°C/W
ψJBJunction-to-board characterization parameter

75.4

°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance

—

°C/W
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.