ZHCSOD1L December   1982  – February 2025 SN54HC14 , SN74HC14

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
    1.     6
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics - 74
    6. 5.6  Electrical Characteristics - 54
    7. 5.7  Switching Characteristics - 74
    8. 5.8  Switching Characteristics - 54
    9. 5.9  Operating Characteristics
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 CMOS Schmitt-Trigger Inputs
      3. 7.3.3 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|14
  • PW|14
  • DB|14
  • N|14
  • NS|14
散热焊盘机械数据 (封装 | 引脚)
订购信息

10 Revision History

Changes from Revision K (June 2021) to Revision L (July 2024)

  • 向器件信息 表中添加了封装尺寸Go
  • Updated thermal values for N package from ΨJB = 40.3 to 40.5, all values in °C/W Go

Changes from Revision J (October 2016) to Revision K (June 2021)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • 更新至全新的数据表标准Go
  • 更新了器件信息 表中 DB 封装的封装尺寸Go
  • Increased D (86 to 133.6), DB (96 to 114.8), NS (76 to 122.6), and PW (113 to 151.7); decreased N (80 to 60.7) °C/WGo