ZHCSS47N 数据表 | 德州仪器 TI.com.cn

ZHCSS47N october 1995 – may 2023 SN54AHCT244 , SN74AHCT244

PRODMIX

请参考 PDF 数据表获取器件具体的封装图。

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		SN74AHCT244						UNIT
		DB	DGV	DW	N	NS	PW
		20 PINS	20 PINS	20 PINS	20 PINS	20 PINS	20 PINS
R_θJA	Junction-to-ambient thermal resistance	99.9	119.2	83.0	54.9	80.4	105.4	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	61.7	34.5	48.9	41.7	46.9	39.5
R_θJB	Junction-to-board thermal resistance	55.2	60.7	50.5	35.8	47.9	56.4
ψ_JT	Junction-to-top characterization parameter	22.6	1.2	21.1	27.9	19.9	3.1
ψ_JB	Junction-to-board characterization parameter	54.8	60.0	50.1	35.7	47.5	55.8

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.