SCLS261O October   1995  – September 2015 SN54AHC541 , SN74AHC541

 

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics, VCC = 3.3 V ± 0.3 V
    7. 6.7  Switching Characteristics, VCC = 5 V ± 0.5 V
    8. 6.8  Noise Characteristics
    9. 6.9  Operating Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • W|20
  • J|20
  • FK|20
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage –0.5 7 V
VI Input voltage(2) –0.5 7 V
VO Output voltage(2) –0.5 VCC + 0.5 V
IIK Input clamp current VI < 0 –20 mA
IOK Output clamp current VO < 0 or VO > VCC ±20 mA
IO Continuous output current VO = 0 to VCC ±25 mA
Continuous current through VCC or GND ±75 mA
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) +1000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101, all pins(2) +2000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
SN54AHC541 SN74AHC541 UNIT
MIN MAX MIN MAX
VCC Supply voltage 2 5.5 2 5.5 V
VIH High-level input voltage VCC = 2 V 1.5 1.5 V
VCC = 3 V 2.1 2.1
VCC = 5.5 V 3.85 3.85
VIL Low-level Input voltage VCC = 2 V 0.5 0.5 V
VCC = 3 V 0.9 0.9
VCC = 5.5 V 1.65 1.65
VI Input voltage 0 5.5 0 5.5 V
VO Output voltage 0 VCC 0 VCC V
IOH High-level output current VCC = 2 V –50 –50 µA
VCC = 3.3 V ± 0.3 V –4 –4 mA
VCC = 5 V ± 0.5 V –8 –8
IOL Low-level output current VCC = 2 V 50 50 µA
VCC = 3.3 V ± 0.3 V 4 4 mA
VCC = 5 V ± 0.5 V 8 8
Δt/Δv Input transition rise or fall rate VCC = 3.3 V ± 0.3 V 100 100 ns/V
VCC = 5 V ± 0.5 V 20 20
TA Operating free-air temperature –55 125 –40 125 °C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004).

6.4 Thermal Information

THERMAL METRIC(1) SN74AHC541 UNIT
DB (SSOP) DGV (TVSOP) DW (SOIC) N
(PDIP)		 NS
(SO)		 PW (TSSOP)
20 PINS 20 PINS 20 PINS 20 PINS 20 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance 99.9 119.2 83.0 54.9 80.4 105.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 61.7 34.5 48.9 41.7 46.9 39.5 °C/W
RθJB Junction-to-board thermal resistance 55.2 60.7 50.5 35.8 47.9 56.4 °C/W
ψJT Junction-to-top characterization parameter 22.6 1.2 21.1 27.9 19.9 3.1 °C/W
ψJB Junction-to-board characterization parameter 54.8 60.0 50.1 35.7 47.5 55.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC TA = 25°C SN54AHC541 SN74AHC541 SN74AHC541
–40°C to 125°C		 UNIT
MIN TYP MAX MIN MAX MIN MAX MIN MAX
VOH IOH = –50 µA 2 V 1.9 2 1.9 1.9 1.9 V
3 V 2.9 3 2.9 2.9 2.9
4.5 V 4.4 4.5 4.4 4.4 4.4
IOH = –4 mA 3 V 2.58 2.48 2.48 2.48
IOH = –8 mA 4.5 V 3.94 3.8 3.8 3.8
VOL IOL = 50 µA 2 V 0.1 0.1 0.1 0.1 V
3 V 0.1 0.1 0.1 0.1
4.5 V 0.1 0.1 0.1 0.1
IOH = 4 mA 3 V 0.36 0.5 0.44 0.5
IOH = 8 mA 4.5 V 0.36 0.5 0.44 0.5
II VI = 5.5 V or GND 0 V to 5.5 V ±0.1 ±1(1) ±1 ±1 µA
IOZ(2) VO = VCC or GND
VI (OE) = VIL or VIH 		5.5 V ±0.25 ±2.5 ±2.5 ±2.5 µA
ICC VI = VCC or GND IO = 0 5.5 V 4 40 40 20 µA
Ci VI = VCC or GND 5 V 2 10 10 pF
CO VO = VCC or GND 5 V 4 pF
(1) On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V.
(2) For input and output pins, IOZ includes the input leakage current.

6.6 Switching Characteristics, VCC = 3.3 V ± 0.3 V

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 2)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 LOAD
CAPACITANCE		 TA = 25°C SN54AHC541 SN74AHC541 SN74AHC541
TA = –40°C to 125°C		 UNIT
TYP MAX MIN MAX MIN MAX MIN MAX
tPLH A Y CL = 15 pF 5(1) 7(1) 1(1) 8.5(1) 1 8.5 1 8.5 ns
tPHL 5(1) 7(1) 1(1) 8.5(1) 1 8.5 1 8.5
tPZH OE Y CL = 15 pF 6(1) 10.5(1) 1(1) 11(1) 1 11 1 11 ns
tPZL 6(1) 10.5(1) 1(1) 11(1) 1 11 1 11
tPHZ OE Y CL = 15 pF 7(1) 11(1) 1(1) 12(1) 1 12 1 12 ns
tPLZ 7(1) 11(1) 1(1) 12(1) 1 12 1 12
tPLH A Y CL = 50 pF 7.5 10.5 1 12 1 12 1 12 ns
tPHL 7.5 10.5 1 12 1 12 1 12
tPZH OE Y CL = 50 pF 8 14 1 16 1 16 1 16 ns
tPZL 8 14 1 16 1 16 1 16
tPHZ OE Y CL = 50 pF 9 15.4 1 17.5 1 17.5 1 17.5 ns
tPLZ 9 15.4 1 17.5 1 17.5 1 17.5
tsk(o) CL = 50 pF 1.5(2) 1.5 ns
tPLH A or B Y CL = 50 pF 6.3 8.8 1 10 1 10 1 10 ns
tPHL 6.3 8.8 1 10 1 10 1 10
(1) On products compliant to MIL-PRF-38535, this parameter is not production tested.
(2) On products compliant to MIL-PRF-38535, this parameter does not apply.

6.7 Switching Characteristics, VCC = 5 V ± 0.5 V

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 2)
PARAMETER FROM
(INPUT)		 TO
(OUTPUT)		 LOAD
CAPACITANCE		 TA = 25°C SN54AHC541 SN74AHC541 TA = –40°C to 125°C
SN74AHC541		 UNIT
TYP MAX MIN MAX MIN MAX MIN MAX
tPLH A Y CL = 15 pF 3.5(1) 5(1) 1(1) 6(1) 1 6 1 6 ns
tPHL 3.5(1) 5(1) 1(1) 6(1) 1 6 1 6
tPZH OE Y CL = 15 pF 4.7(1) 7.2(1) 1(1) 8.5(1) 1 8.5 1 8.5 ns
tPZL 4.7(1) 7.2(1) 1(1) 8.5(1) 1 8.5 1 8.5
tPHZ OE Y CL = 15 pF 5(1) 7.5(1) 1(1) 8(1) 1 8 1 8 ns
tPLZ 5(1) 7.5(1) 1(1) 8(1) 1 8 1 8
tPLH A Y CL = 50 pF 5 7 1 8 1 8 1 8 ns
tPHL 5 7 1 8 1 8 1 8
tPZH OE Y CL = 50 pF 6.2 9.2 1 10.5 1 10.5 1 10.5 ns
tPZL 6.2 9.2 1 10.5 1 10.5 1 10.5
tPHZ OE Y CL = 50 pF 6 8.8 1 10 1 10 1 10 ns
tPLZ 6 8.8 1 10 1 10 1 10
tsk(o) CL = 50 pF 1(2) 1 1 ns
(1) On products compliant to MIL-PRF-38535, this parameter is not production tested.
(2) On products compliant to MIL-PRF-38535, this parameter does not apply.

6.8 Noise Characteristics

VCC = 5 V, CL = 50 pF, TA = 25°C(1)
PARAMETER SN74AHC541 UNIT
MIN MAX
VOL(P) Quiet output, maximum dynamic VOL 0.8 V
VOL(V) Quiet output, minimum dynamic VOL –0.8 V
VOH(V) Quiet output, minimum dynamic VOH 4.7 V
VIH(D) High-level dynamic input voltage 3.5 V
VIL(D) Low-level dynamic input voltage 1.5 V
(1) Characteristics are for surface-mount packages only.

6.9 Operating Characteristics

VCC = 5 V, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance No load, f = 1 MHz 12 pF

6.10 Typical Characteristics

SN74AHC541 SN54AHC541 typchart_scls261.png Figure 1. TPD (Typical) vs VCC at CL = 15pF & TA = 25°C