SNVS697E January   2011  – December 2016 SM72485

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Control Circuit Overview
      2. 7.3.2 Current Limit
      3. 7.3.3 N-Channel Buck Switch and Driver
      4. 7.3.4 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Start-Up Regulator (VCC)
      2. 7.4.2 Regulation Comparator
      3. 7.4.3 Overvoltage Comparator
      4. 7.4.4 ON-Time Generator and Shutdown
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Selection of External Components
          1. 8.2.2.1.1  RFB1 and RFB2
          2. 8.2.2.1.2  Fs and RT
          3. 8.2.2.1.3  L1
          4. 8.2.2.1.4  C3
          5. 8.2.2.1.5  C2 and R3
          6. 8.2.2.1.6  ESR and R3
          7. 8.2.2.1.7  RCL
          8. 8.2.2.1.8  D1
          9. 8.2.2.1.9  C1
          10. 8.2.2.1.10 C4
          11. 8.2.2.1.11 C5
        2. 8.2.2.2 Low Output Ripple Configurations
          1. 8.2.2.2.1 Reduced Ripple Configuration
          2. 8.2.2.2.2 Minimum Ripple Configuration
          3. 8.2.2.2.3 Alternate Minimum Ripple Configuration
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Layout

Layout Guidelines

A proper layout is essential for optimum performance of the circuit. In particular, the following guidelines must be observed.

  1. CIN: The loop consisting of input capacitor (CIN), VIN pin, and RTN pin carries switching currents. Therefore, the input capacitor must be placed close to the IC, directly across VIN and RTN pins and the connections to these two pins must be direct to minimize the loop area. In general, it is not possible to accommodate all of input capacitance near the IC. A good practice is to use a 0.1-µF or 0.47-µF capacitor directly across the VIN and RTN pins close to the IC, and the remaining bulk capacitor as close as possible.
  2. CVCC and CBST: The VCC and bootstrap (BST) bypass capacitors supply switching currents to the high- and low-side gate drivers. These two capacitors must also be placed as close to the IC as possible, and the connecting trace length and loop area must be minimized.
  3. The Feedback trace carries the output voltage information and a small ripple component that is necessary for proper operation of SM72485. Therefore, take care while routing the feedback trace to avoid coupling any noise to this pin. In particular, feedback trace must not run close to magnetic components, or parallel to any other switching trace.
  4. SW trace: The SW node switches rapidly between VIN and GND every cycle and is therefore a possible source of noise. The SW node area must be minimized. In particular, the SW node must not be inadvertently connected to a copper plane or pour.

Layout Example

SM72485 layout_SNVS697.gif Figure 16. Layout Recommendation