SBOS342C December   2008  – November 2015 OPA659

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Related Operational Amplifier Products
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Feature Description
      1. 8.2.1 Input and ESD Protection
    3. 8.3 Device Functional Modes
      1. 8.3.1 Split-Supply Operation (±3.5 V to ±6.5 V)
      2. 8.3.2 Single-Supply Operation (7 V to 13 V)
  9. 9 Application Information
    1. 9.1 Application Information
      1. 9.1.1 Wideband, Noninverting Operation
      2. 9.1.2 Wideband, Inverting Gain Operation
      3. 9.1.3 Operating Suggestions
        1. 9.1.3.1 Setting Resistor Values To Minimize Noise
        2. 9.1.3.2 Frequency Response Control
        3. 9.1.3.3 Driving Capacitive Loads
        4. 9.1.3.4 Distortion Performance
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Pad Information
    4. 11.4 Schematic and PCB Layout
    5. 11.5 Evaluation Module
      1. 11.5.1 Bill of Materials
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from B Revision (August 2009) to C Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Deleted THERMAL CHARACTERISTICS row from Electrical Characteristics Go

Changes from A Revision (March, 2009) to B Revision

  • Removed lead temperature specification from Absolute Maximum Ratings tableGo
  • Added DRB package to test condition for Input Offset Voltage parameter, TA = –40°C to 85°CGo
  • Added performance specifications for Input Offset Voltage parameter, DBV packageGo
  • Added performance specifications for Average Offset Voltage Drift parameter, DBV packageGo
  • Added footnote (2) to Electrical Characteristics (VS = ±6V) tableGo
  • Added paragraph (f) to the Board Layout sectionGo

Changes from * Revision (December, 2008) to A Revision

  • Changed Changed ordering information for SOTS23-5 (DBV) package and added footnote; availability expected 2Q 2009 Go