ZHCS228A June   2011  – February 2024 OPA564-Q1

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Adjustable Current Limit
        1. 7.3.1.1 Setting the Current Limit
      2. 7.3.2 Enable and Shutdown (E/S) Pin
      3. 7.3.3 Input Protection
      4. 7.3.4 Output Shutdown
      5. 7.3.5 Microcontroller Compatibility
      6. 7.3.6 Current Limit Flag
      7. 7.3.7 Thermal Protection
      8. 7.3.8 Junction Temperature Measurement Using TSENSE
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Basic Configuration
      2. 8.1.2 Output-Stage Compensation
      3. 8.1.3 Output Protection
      4. 8.1.4 Power Dissipation and Safe Operating Area
    2. 8.2 Typical Applications
      1. 8.2.1 Improved Howland Current Pump
      2. 8.2.2 Programmable Power Supply
      3. 8.2.3 Powerline Communication
      4. 8.2.4 Motor-Drive Circuit
      5. 8.2.5 DC Motor-Speed Controller (Without Tachometer)
      6. 8.2.6 Generating VDIG
      7. 8.2.7 Temperature Measurement
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Thermally Enhanced PowerPAD™ Integrated Circuit Package
          1. 8.4.1.1.1 Bottom-Side Thermal Pad Assembly Process
  10. Device and Documentation Support
    1. 9.1 接收文档更新通知
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Typical Characteristics

at TCASE = 25°C, VS = ±12V, RLOAD = 20kΩ to GND, RSET = 7.5kΩ, and E/S pin enabled (unless otherwise noted)

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Figure 6-1 Quiescent Current vs Supply Voltage
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No load  
Figure 6-3 Large−Signal Step Response
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Figure 6-5 Small−Signal Step Response
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Figure 6-7 IQ vs Temperature
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Figure 6-9 AOL, PSRR, and CMRR vs Temperature
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Figure 6-11 IQ, Shutdown vs Temperature
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Figure 6-13 Gain and Phase vs Frequency
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Figure 6-15 Output Voltage Swing vs Frequency
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Figure 6-17 Total Harmonic Distortion + Noise vs Amplitude
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Figure 6-19 Total Harmonic Distortion + Noise vs Amplitude
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Figure 6-21 Total Harmonic Distortion + Noise vs Frequency
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Figure 6-23 Input Voltage Spectral Noise and Current Noise vs Frequency
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No load  
Figure 6-25 Closed-Loop Output Impedance
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RLOAD = 100Ω  
Figure 6-27 Enable Response
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Figure 6-29 Enable Time (Inverting Configuration)
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Figure 6-31 Output Current Limit vs RSET (Sourcing Current)
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Figure 6-33 Quiescent Current Increase vs RSET
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Figure 6-2 Output Voltage Swing vs Output Current
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Figure 6-4 Large−Signal Step Response
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Figure 6-6 Small−Signal Overshoot vs Load Capacitance
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Figure 6-8 Offset Voltage vs Temperature
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Figure 6-10 IB vs Temperature
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Figure 6-12 IDIG vs Temperature
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Figure 6-14 Common-Mode Rejection Ratio and Power-Supply Rejection Ratio vs Frequency
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Figure 6-16 Output Voltage Swing vs Frequency
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Figure 6-18 Total Harmonic Distortion + Noise vs Amplitude
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Figure 6-20 Total Harmonic Distortion + Noise vs Frequency
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Figure 6-22 Total Harmonic Distortion + Noise vs Frequency
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No load  
Figure 6-24 Open-Loop Output Impedance
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Figure 6-26 Input Bias Current vs Common-Mode Voltage
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Figure 6-28 Shutdown Time (Inverting Configuration)
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Figure 6-30 Current Limit Percent Error vs RSET
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Figure 6-32 Output Current Limit vs RSET (Sinking Current)
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Figure 6-34 Offset Voltage Production Distribution