ZHCSQQ7B June   2022  – November 2022 OPA4991-EP

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 四通道器件的热性能信息
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Protection Circuitry
      2. 7.3.2 EMI Rejection
      3. 7.3.3 Thermal Protection
      4. 7.3.4 Capacitive Load and Stability
      5. 7.3.5 Common-Mode Voltage Range
      6. 7.3.6 Phase Reversal Protection
      7. 7.3.7 Electrical Overstress
      8. 7.3.8 Overload Recovery
      9. 7.3.9 Typical Specifications and Distributions
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Low-Side Current Measurement
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 TINA-TI (Free Software Download)
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 术语表
  10. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 四通道器件的热性能信息

热指标 (1) OPA4991-EP 单位
DYY 
(SOT-23)
14 引脚
RθJA 结至环境热阻 121.6 °C/W
RθJC(top) 结至外壳（顶部）热阻 53.6 °C/W
RθJB 结至电路板热阻 47.8 °C/W
ψJT 结至顶部特征参数 2.1 °C/W
ψJB 结至电路板特征参数 47.6 °C/W
RθJC(bot) 结至外壳（底部）热阻 不适用 °C/W
(1) 有关新旧热指标的更多信息，请参阅半导体和 IC 封装热指标 应用报告，SPRA953。