ZHCS183G May   2011  – June 2015 OPA2314 , OPA314 , OPA4314

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA314
    5. 6.5 Thermal Information: OPA2314
    6. 6.6 Thermal Information: OPA4314
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Rail-to-Rail Input
      3. 7.3.3 Input and ESD Protection
      4. 7.3.4 Common-Mode Rejection Ratio (CMRR)
      5. 7.3.5 EMI Susceptibility and Input Filtering
      6. 7.3.6 Rail-to-Rail Output
      7. 7.3.7 Capacitive Load and Stability
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 General Configurations
      2. 8.1.2 Capacitive Load and Stability
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Amplifier Selection
        2. 8.2.2.2 Passive Component Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 器件命名规则
        1. 11.1.1.1 双边扁平无引线 (DFN) 封装
    2. 11.2 相关链接
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from F Revision (April 2013) to G Revision

  • Added ESD 额定值表，特性 描述 部分，器件功能模式，应用和实施部分，电源相关建议部分，布局部分，器件和文档支持部分以及机械、封装和可订购信息部分Go
  • 已将修订历史记录移至第二页Go

Changes from E Revision (September 2012) to F Revision

  • Changed 文档标题（删除了“超值系列”）Go

Changes from D Revision (March 2012) to E Revision

  • 已将“超值系列”添加至标题Go

Changes from C Revision (February 2012) to D Revision

  • Changed 将产品状态从混合状态改为生产数据Go
  • Deleted 封装信息表中的底纹和脚注 2Go

Changes from B Revision (December 2011) to C Revision

  • Changed 第一项 特性 要点Go
  • Deleted 封装信息表 OPA314 SOT23-5 行（DBV 封装）的底纹Go
  • Added OPA2314, OPA4314 to first two Power Supply, Quiescent current per amplifier parameter rows in Electrical Characteristics table Go
  • Added OPA314 Power Supply, Quiescent current per amplifier parameter row to Electrical Characteristics tableGo

Changes from A Revision (August 2011) to B Revision

  • Deleted 封装信息表 OPA2314 MSOP-8 行的底纹Go