ZHCSMS9J September   1973  – February 2025 NA555 , NE555 , SA555 , SE555

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Monostable Operation
      2. 6.3.2 Astable Operation
      3. 6.3.3 Frequency Divider
    4. 6.4 Device Functional Modes
  8. 7 Applications and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Missing-Pulse Detector
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Pulse-Width Modulation
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Curve
      3. 7.2.3 Pulse-Position Modulation
        1. 7.2.3.1 Design Requirements
        2. 7.2.3.2 Detailed Design Procedure
        3. 7.2.3.3 Application Curve
      4. 7.2.4 Sequential Timer
        1. 7.2.4.1 Design Requirements
        2. 7.2.4.2 Detailed Design Procedure
        3. 7.2.4.3 Application Curve
    3. 7.3 Power Supply Recommendations
  9. 8 Device and Documentation Support
    1. 8.1 接收文档更新通知
    2. 8.2 支持资源
    3. 8.3 Trademarks
    4. 8.4 静电放电警告
    5. 8.5 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|8
  • P|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1) NA556, NE556, SA555, SE555 SE555 NA555, NE555 NE555 UNIT
D
(SOIC)		 FK
(LCCC)		 JG
(CDIP)		 P
(PDIP)		 PS
(SO)		 PW
(TSSOP)
8 PINS 20 PINS 8 PINS 8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 125.4 92.2 125.0 98.5 124.5 164.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 64.9 67.6 73.3 77.8 61.2 70.5 °C/W
RθJB Junction-to-board thermal resistance 73.2 66.7 114.9 61.0 79.3 104.8 °C/W
ψJT Junction-to-top characterization parameter 14.3 61.6 44.4 43.9 16.5 8.2 °C/W
ψJB Junction-to-board characterization parameter 72.1 66.5 106.6 60.3 77.8 103.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 14.2 29.3 N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.