ZHCSGO9C June   2017  – September 2018 MSP430FR6035 , MSP430FR6037 , MSP430FR60371 , MSP430FR6045 , MSP430FR6047 , MSP430FR60471

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能框图
  2. 2修订历史记录
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram
    2. 4.2 Pin Attributes
    3. 4.3 Signal Descriptions
      1. Table 4-2 Signal Descriptions
    4. 4.4 Pin Multiplexing
    5. 4.5 Buffer Type
    6. 4.6 Connection of Unused Pins
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5  Typical Characteristics, Active Mode Supply Currents
    6. 5.6  Low-Power Mode (LPM0, LPM1) Supply Currents Into VCC Excluding External Current
    7. 5.7  Low-Power Mode (LPM2, LPM3, LPM4) Supply Currents (Into VCC) Excluding External Current
    8. 5.8  Low-Power Mode With LCD Supply Currents (Into VCC) Excluding External Current
    9. 5.9  Low-Power Mode (LPMx.5) Supply Currents (Into VCC) Excluding External Current
    10. 5.10 Typical Characteristics, Low-Power Mode Supply Currents
    11. 5.11 Typical Characteristics, Current Consumption per Module
    12. 5.12 Thermal Resistance Characteristics for 100-Pin LQFP (PZ) Package
    13. 5.13 Timing and Switching Characteristics
      1. 5.13.1  Power Supply Sequencing
        1. Table 5-1 Brownout and Device Reset Power Ramp Requirements
        2. Table 5-2 SVS
      2. 5.13.2  Reset Timing
        1. Table 5-3 Reset Input
      3. 5.13.3  Clock Specifications
        1. Table 5-4 Low-Frequency Crystal Oscillator, LFXT
        2. Table 5-5 High-Frequency Crystal Oscillator, HFXT
        3. Table 5-6 DCO
        4. Table 5-7 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        5. Table 5-8 Module Oscillator (MODOSC)
      4. 5.13.4  Wake-up Characteristics
        1. Table 5-9  Wake-up Times From Low-Power Modes and Reset
        2. Table 5-10 Typical Wake-up Charges
        3. 5.13.4.1   Typical Characteristics, Average LPM Currents vs Wake-up Frequency
      5. 5.13.5  Digital I/Os
        1. Table 5-11 Digital Inputs
        2. Table 5-12 Digital Outputs
        3. 5.13.5.1   Typical Characteristics, Digital Outputs
      6. 5.13.6  LEA
        1. Table 5-13 Low-Energy Accelerator (LEA) Performance
      7. 5.13.7  Timer_A and Timer_B
        1. Table 5-14 Timer_A
        2. Table 5-15 Timer_B
      8. 5.13.8  eUSCI
        1. Table 5-16 eUSCI (UART Mode) Clock Frequency
        2. Table 5-17 eUSCI (UART Mode) Switching Characteristics
        3. Table 5-18 eUSCI (SPI Master Mode) Clock Frequency
        4. Table 5-19 eUSCI (SPI Master Mode) Switching Characteristics
        5. Table 5-20 eUSCI (SPI Slave Mode) Switching Characteristics
        6. Table 5-21 eUSCI (I2C Mode) Switching Characteristics
      9. 5.13.9  Segment LCD Controller
        1. Table 5-22 LCD_C Recommended Operating Conditions
        2. Table 5-23 LCD_C Electrical Characteristics
      10. 5.13.10 ADC12_B
        1. Table 5-24 12-Bit ADC, Power Supply and Input Range Conditions
        2. Table 5-25 12-Bit ADC, Timing Parameters
        3. Table 5-26 12-Bit ADC, Linearity Parameters
        4. Table 5-27 12-Bit ADC, Dynamic Performance With External Reference
        5. Table 5-28 12-Bit ADC, Dynamic Performance With Internal Reference
        6. Table 5-29 12-Bit ADC, Temperature Sensor and Built-In V1/2
        7. Table 5-30 12-Bit ADC, External Reference
      11. 5.13.11 Reference
        1. Table 5-31 REF, Built-In Reference
      12. 5.13.12 Comparator
        1. Table 5-32 Comparator_E
      13. 5.13.13 FRAM
        1. Table 5-33 FRAM
      14. 5.13.14 USS
        1. Table 5-34 USS Recommended Operating Conditions
        2. Table 5-35 USS LDO
        3. Table 5-36 USSXTAL
        4. Table 5-37 USS HSPLL
        5. Table 5-38 USS SDHS
        6. Table 5-39 USS PHY Output Stage
        7. Table 5-40 USS PHY Input Stage, Multiplexer
        8. Table 5-41 USS PGA
        9. Table 5-42 USS Bias Voltage Generator
      15. 5.13.15 Emulation and Debug
        1. Table 5-43 JTAG and Spy-Bi-Wire Interface
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  CPU
    3. 6.3  Ultrasonic Sensing Solution (USS) Module
    4. 6.4  Low-Energy Accelerator (LEA) for Signal Processing
    5. 6.5  Operating Modes
      1. 6.5.1 Peripherals in Low-Power Modes
      2. 6.5.2 Idle Currents of Peripherals in LPM3 and LPM4
    6. 6.6  Interrupt Vector Table and Signatures
    7. 6.7  Bootloader (BSL)
    8. 6.8  JTAG Operation
      1. 6.8.1 JTAG Standard Interface
      2. 6.8.2 Spy-Bi-Wire (SBW) Interface
    9. 6.9  FRAM Controller A (FRCTL_A)
    10. 6.10 RAM
    11. 6.11 Tiny RAM
    12. 6.12 Memory Protection Unit (MPU) Including IP Encapsulation
    13. 6.13 Peripherals
      1. 6.13.1  Digital I/O
      2. 6.13.2  Oscillator and Clock System (CS)
      3. 6.13.3  Power-Management Module (PMM)
      4. 6.13.4  Hardware Multiplier (MPY)
      5. 6.13.5  Real-Time Clock (RTC_C)
      6. 6.13.6  Measurement Test Interface (MTIF)
      7. 6.13.7  Watchdog Timer (WDT_A)
      8. 6.13.8  System Module (SYS)
      9. 6.13.9  DMA Controller
      10. 6.13.10 Enhanced Universal Serial Communication Interface (eUSCI)
      11. 6.13.11 TA0, TA1, and TA4
      12. 6.13.12 TA2 and TA3
      13. 6.13.13 TB0
      14. 6.13.14 ADC12_B
      15. 6.13.15 USS
      16. 6.13.16 Comparator_E
      17. 6.13.17 CRC16
      18. 6.13.18 CRC32
      19. 6.13.19 AES256 Accelerator
      20. 6.13.20 True Random Seed
      21. 6.13.21 Shared Reference (REF)
      22. 6.13.22 LCD_C
      23. 6.13.23 Embedded Emulation
        1. 6.13.23.1 Embedded Emulation Module (EEM) (S Version)
        2. 6.13.23.2 EnergyTrace++ Technology
    14. 6.14 Input/Output Diagrams
      1. 6.14.1  Port Function Select Registers (PySEL1 , PySEL0)
      2. 6.14.2  Port P1 (P1.0 and P1.1) Input/Output With Schmitt Trigger
      3. 6.14.3  Port P1 (P1.2 to P1.7) Input/Output With Schmitt Trigger
      4. 6.14.4  Port P2 (P2.0 to P2.3) Input/Output With Schmitt Trigger
      5. 6.14.5  Port P2 (P2.4 to P2.7) Input/Output With Schmitt Trigger
      6. 6.14.6  Port P3 (P3.0 to P3.7) Input/Output With Schmitt Trigger
      7. 6.14.7  Port P4 (P4.0 to P4.7) Input/Output With Schmitt Trigger
      8. 6.14.8  Port P5 (P5.0 to P5.7) Input/Output With Schmitt Trigger
      9. 6.14.9  Port P6 (P6.0) Input/Output With Schmitt Trigger
      10. 6.14.10 Port P6 (P6.1 to P6.5) Input/Output With Schmitt Trigger
      11. 6.14.11 Port P6 (P6.6 and P6.7) Input/Output With Schmitt Trigger
      12. 6.14.12 Port P7 (P7.0 to P7.3) Input/Output With Schmitt Trigger
      13. 6.14.13 Port P7 (P7.4) Input/Output With Schmitt Trigger
      14. 6.14.14 Port P7 (P7.5) Input/Output With Schmitt Trigger
      15. 6.14.15 Port P7 (P7.6 and P7.7) Input/Output With Schmitt Trigger
      16. 6.14.16 Port P8 (P8.0 to P8.3) Input/Output With Schmitt Trigger
      17. 6.14.17 Port P8 (P8.4 to P8.7) Input/Output With Schmitt Trigger
      18. 6.14.18 Port P9 (P9.0 to P9.3) Input/Output With Schmitt Trigger
      19. 6.14.19 Port PJ (PJ.0 to PJ.3) JTAG Pins TDO, TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger
      20. 6.14.20 Port PJ (PJ.4 and PJ.5) Input/Output With Schmitt Trigger
      21. 6.14.21 Port PJ (PJ.6 and PJ.7) Input/Output With Schmitt Trigger
    15. 6.15 Device Descriptors (TLV)
    16. 6.16 Memory Map
      1. 6.16.1 Peripheral File Map
    17. 6.17 Identification
      1. 6.17.1 Revision Identification
      2. 6.17.2 Device Identification
      3. 6.17.3 JTAG Identification
  7. 7Applications, Implementation, and Layout
    1. 7.1 Device Connection and Layout Fundamentals
      1. 7.1.1  Power Supply Decoupling and Bulk Capacitors
      2. 7.1.2  External Oscillator (HFXT and LFXT)
      3. 7.1.3  USS Oscillator (USSXT)
      4. 7.1.4  Transducer Connection to the USS Module
      5. 7.1.5  Charge Pump Control of Input Multiplexer
      6. 7.1.6  JTAG
      7. 7.1.7  Reset
      8. 7.1.8  Unused Pins
      9. 7.1.9  General Layout Recommendations
      10. 7.1.10 Do's and Don'ts
    2. 7.2 Peripheral- and Interface-Specific Design Information
      1. 7.2.1 ADC12_B Peripheral
        1. 7.2.1.1 Partial Schematic
        2. 7.2.1.2 Design Requirements
        3. 7.2.1.3 Detailed Design Procedure
        4. 7.2.1.4 Layout Guidelines
      2. 7.2.2 LCD_C Peripheral
        1. 7.2.2.1 Partial Schematic
        2. 7.2.2.2 Design Requirements
        3. 7.2.2.3 Detailed Design Procedure
        4. 7.2.2.4 Layout Guidelines
  8. 8器件和文档支持
    1. 8.1 入门和下一步
    2. 8.2 器件命名规则
    3. 8.3 工具和软件
    4. 8.4 文档支持
    5. 8.5 相关链接
    6. 8.6 商标
    7. 8.7 静电放电警告
    8. 8.8 Export Control Notice
    9. 8.9 Glossary
  9. 9机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.4 文档支持

以下文档对 MSP430FR604x(1)、MSP430FR603x(1)、MCU 进行了介绍。www.ti.com.cn 网站上提供了这些文档的副本。

接收文档更新通知

要接收文档更新通知（包括芯片勘误表），请转至 ti.com.cn 上您的器件对应的产品文件夹（关于产品文件夹的链接，请参见Section 8.5）。单击右上角的“提醒我”(Alert me) 按钮。点击注册后，即可收到产品信息更改每周摘要（如有）。有关更改的详细信息，请查阅已修订文档的修订历史记录。

勘误

用户指南

    《MSP430™ FRAM 器件引导加载程序 (BSL) 用户指南》

    MSP430 微控制器 (MCU) 上的引导加载程序 (BSL) 允许用户在原型设计、最终生产和使用期间与 MSP430 MCU 中的嵌入式存储器进行通信。可编程存储器（FRAM 存储器）和数据存储器 (RAM) 均可按要求予以修改。

    通过 JTAG 接口进行 MSP430™ 编程

    此文档介绍了使用 JTAG 通信端口擦除、编程和验证基于 MSP430 闪存和 FRAM 的微控制器系列的存储器模块所需的功能。此外，该文档还介绍了如何编程所有 MSP430 器件上均具备的 JTAG 访问安全保险丝。此文档介绍了使用标准四线制 JTAG 接口和两线制 JTAG 接口（也称为 Spy-Bi-Wire (SBW)）的器件访问。

应用报告

    《MSP430™ 32kHz 晶体振荡器》

    对于稳定的晶体振荡器，选择合适的晶振、正确的负载电路和适当的电路板布局布线至关重要。该应用报告总结了晶体振荡器的功能，介绍了用于选择合适的晶体以实现 MSP430 超低功耗运行的参数。此外，还给出了正确电路板布局的提示和示例。此外，为了确保振荡器在大规模生产后能够稳定运行，还可能需要进行一些振荡器测试，该文档中提供了有关这些测试的详细信息。

    《MSP430™ 系统级 ESD 注意事项》

    系统级 ESD 对于低电压下的硅晶技术以及经济高效型和超低功耗组件的需求日益增加。本应用报告解决了三大不同的 ESD 主题，帮助电路板设计人员和 OEM 了解并设计强大的系统级设计：(1) 组件及 ESD 测试和系统级 ESD 测试、二者的差异及组件级 ESD 标准无法保障系统级稳健性的原因。(2) 不同层级的系统级 ESD 防护常规设计指南，包括外壳、电缆、PCB 布线以及板载 ESD 保护器件。(3) 系统高效 ESD 设计 (SEED) 简介，这是一种可实现系统级 ESD 稳健性的板载和片上 ESD 防护协同设计方法，包括示例仿真和测试结果。另外还介绍了若干实际应用系统级 ESD 保护设计示例及其结果。