2 修订历史记录
从修订版本 E 更改为修订版本 F
Changes from September 26, 2018 to September 23, 2019
- Added the note "TI recommends connecting the exposed thermal pad to VSS" to Figure 4-2, 64-Pin RGC Package (Top View) – MSP430F5328IRGC, MSP430F5326IRGC, MSP430F5324IRGCGo
- Added a row for the QFN thermal pad to Table 4-1, Signal DescriptionsGo
Changes from February 27, 2013 to September 25, 2018
- 通篇更改了文档格式和结构,其中包括添加章节编号Go
- 添加了Section 1.2应用Go
- 添加了器件信息 表Go
- 添加了Section 1.4并将所有功能方框图移到这里Go
- Added Section 3.1, Related ProductsGo
- Added signal names to the ZQE pinoutGo
- Added "Port U is supplied by the LDOO rail" to the PU.0 and PU.1 descriptions in Table 4-1, Signal DescriptionsGo
- Added note to RST/NMI/SBWTDIO pinGo
- Added typical conditions statements at the beginning of Section 5, SpecificationsGo
- Added Section 5, Specifications, and moved all electrical specifications to itGo
- Added Section 5.2, ESD RatingsGo
- Added note to CVCOREGo
- Moved Section 5.6, Thermal Resistance CharacteristicsGo
- Added note to RPullGo
- Changed the TYP value of the CL,eff parameter with Test Conditions of "XTS = 0, XCAPx = 0" from 2 pF to 1 pF in Section 5.15, Crystal Oscillator, XT1, Low-Frequency ModeGo
- Changed the MIN value of the V(DVCC_BOR_hys) parameter from 60 mV to 50 mV in Section 5.20, PMM, Brownout Reset (BOR)Go
- Updated notes (1) and (2) and added note (3) in Section 5.26, Wake-up Times From Low-Power Modes and ResetGo
- Removed ADC12DIV from the formula for the TYP value in the second row of the tCONVERT parameter in Section 5.36, 12-Bit ADC, Timing Parameters, because ADC12CLK is after divisionGo
- For the tEN_CMP parameter in Section 5.42, Comparator_B: Changed the Test Condition of the first row from "CBPWRMD = 00, 01, 10" to "CBPWRMD = 00, 01"; Added a second row with Test Conditions of "CBPWRMD = 10" and MAX value of 100 µsGo
- Changed all instances of "bootstrap loader" to "bootloader" throughout documentGo
- Corrected spelling of NMIIFG in Table 6-8, System Module Interrupt Vector RegistersGo
- Changed Table 6-56, Port PU.0, PU.1 FunctionsGo
- 添加了Section 7器件和文档支持 并将“器件命名规则”、“ESD 注意事项”和“商标”部分移到这里Go
- 将先前的“工具支持”部分替换成了Section 7.3工具与软件Go
- 添加了Section 8机械、封装和可订购信息Go