ZHCSNP2
March 2021
LP87702
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
I2C Serial Bus Timing Parameters
6.7
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Descriptions
7.3.1
Step-Down DC/DC Converters
7.3.1.1
Overview
7.3.1.2
Transition Between PWM and PFM Modes
7.3.1.3
Buck Converter Load Current Measurement
7.3.2
Boost Converter
7.3.3
Spread-Spectrum Mode
7.3.4
Sync Clock Functionality
7.3.5
Power-Up
7.3.6
Buck and Boost Control
7.3.6.1
Enabling and Disabling Converters
7.3.6.2
Changing Buck Output Voltage
7.3.7
Enable and Disable Sequences
7.3.8
Window Watchdog
7.3.9
Device Reset Scenarios
7.3.10
Diagnostics and Protection Features
7.3.10.1
Voltage Monitorings
7.3.10.2
Interrupts
7.3.10.3
Power-Good Information to Interrupt, PG0, and PG1 Pins
7.3.10.3.1
PGx Pin Gated (Unusual) Mode
7.3.10.3.2
PGx Pin Operation in Continuous Mode
7.3.10.3.3
Summary of PG0, PG1 Gated, and Continuous Operating Modes
7.3.10.4
Warning Interrupts for System Level Diagnostics
7.3.10.4.1
Output Power Limit
7.3.10.4.2
Thermal Warning
7.3.10.5
Protections Causing Converter Disable
7.3.10.5.1
Short-Circuit and Overload Protection
7.3.10.5.2
Overvoltage Protection
7.3.10.5.3
Thermal Shutdown
7.3.10.6
Protections Causing Device Power Down
7.3.10.6.1
Undervoltage Lockout
7.3.11
OTP Error Correction
7.3.12
Operation of GPO Signals
7.3.13
Digital Signal Filtering
7.4
Device Functional Modes
7.4.1
Modes of Operation
7.5
Programming
7.5.1
I2C-Compatible Interface
7.5.1.1
Data Validity
7.5.1.2
Start and Stop Conditions
7.5.1.3
Transferring Data
7.5.1.4
I2C-Compatible Chip Address
7.5.1.5
Auto Increment Feature
7.6
Register Maps
7.6.1
Register Descriptions
7.6.1.1
LP8770_map Registers
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Application Components
8.2.2.1.1
Inductor Selection
8.2.2.1.2
Buck Input Capacitor Selection
8.2.2.1.3
Buck Output Capacitor Selection
8.2.2.1.4
Boost Input Capacitor Selection
8.2.2.1.5
Boost Output Capacitor Selection
8.2.2.1.6
Supply Filtering Components
8.2.3
Current Limit vs Maximum Output Current
8.2.4
Application Curves
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
第三方产品免责声明
11.2
Receiving Notification of Documentation Updates
11.3
支持资源
11.4
Trademarks
11.5
静电放电警告
11.6
术语表
12
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
RHB|32
MPQF130D
散热焊盘机械数据 (封装 | 引脚)
RHB|32
QFND590
订购信息
zhcsnp2_oa
zhcsnp2_pm