ZHCSAW4M December   2004  – December 2015 LP38690 , LP38692

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Enable (EN)
      2. 7.3.2 Thermal Shutdown Protection (TSD)
      3. 7.3.3 Foldback Current Limiting
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable (EN)
      2. 7.4.2 Minimum Operating Input Voltage (VIN)
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Reverse Voltage
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Power Dissipation and Device Operation
        2. 8.2.2.2 External Capacitors
          1. 8.2.2.2.1 Input Capacitor
          2. 8.2.2.2.2 Output Capacitor
          3. 8.2.2.2.3 No Load Stability
          4. 8.2.2.2.4 Capacitor Characteristics
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 PCB Layout
    2. 10.2 Layout Examples
    3. 10.3 WSON Mounting
    4. 10.4 RFI/EMI Susceptibility
    5. 10.5 Output Noise
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档　
    2. 11.2 相关链接
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from L Revision (March 2015) to M Revision

  • Added Go
  • Added Caution note to Foldback Current Limiting subsection Go

Changes from K Revision (December 2014) to L Revision

  • Changed "mA" back to "mV" - error from SDS conversion.Go

Changes from J Revision (April 2013) to K Revision

  • Changed 器件信息和 ESD 额定值表，特性描述，器件功能模式，应用和实施，电源相关建议，布局，器件和文档支持以及机械、封装和可订购信息部分；更新了热特性值；已将一些曲线移至应用曲线部分；封装名称已由 PFM 更改为 TO-252（由国家命名规则更改为 TI 命名规则），引脚名称已由 VIN、VOUT 改为 IN、OUT。 Go

Changes from I Revision (April 2013) to J Revision

  • Changed layout of National Data Sheet to TI formatGo