SNVS137I March   1999  – September 2015 LP2986

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Function
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 High-Accuracy Output Voltage
      2. 7.3.2 Error Detection Comparator Output
      3. 7.3.3 Thermal Protection
      4. 7.3.4 Short-Circuit Protection (Current Limit)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Fixed or Adjustable Regulated Output
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Using an External Resistive Divider
        2. 8.2.2.2 External Capacitors
          1. 8.2.2.2.1 Input Capacitor
          2. 8.2.2.2.2 Output Capacitor
        3. 8.2.2.3 Capacitor Characteristics
          1. 8.2.2.3.1 Tantalum
          2. 8.2.2.3.2 Ceramic
          3. 8.2.2.3.3 Aluminum
        4. 8.2.2.4 Reverse Input-Output Voltage
        5. 8.2.2.5 WSON Package Devices
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 WSON Mounting
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from H Revision (April 2013) to I Revision

  • Added Device Information and Pin Configuration and Functions sections, ESD Ratings table, update Thermal Values, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
  • Deleted Lead Temp from Abs Max table (in POA); delete Heatsinking sections re: specific packages (outdated info) Go

Changes from G Revision (April 2013) to H Revision

  • Changed layout of National Data Sheet to TI formatGo