ZHCSH88G December   2017  – February 2022 LMV321A , LMV324A , LMV358A

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Functions and Configurations
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: LMV321A
    5. 6.5 Thermal Information: LMV358A
    6. 6.6 Thermal Information: LMV324A
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Input Common Mode Range
      3. 7.3.3 Rail-to-Rail Output
      4. 7.3.4 Overload Recovery
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 LMV3xxA Low-Side, Current Sensing Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Single-Supply Photodiode Amplifier
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. Power Supply Recommendations
    1. 9.1 Input and ESD Protection
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Revision History

Changes from Revision F (January 2020) to Revision G (February 2022)

  • 更新了整个文档中的表、图和交叉参考的编号格式Go
  • 说明 部分新增了 SOT-23 (DYY) 封装Go
  • Added SOT-23 (DYY) package information to Pin Configuration and Functions sectionGo
  • Added SOT-23 (DYY) package to Thermal Information: LMV324A Go

Changes from Revision E (September 2019) to Revision F (January 2020)

  • 为低成本应用新增了“可扩展 CMOS 放大器Go
  • 删除了采用 TSSOP 封装的 TLV9002 和 TLV9004 器件上的“预览”标识。Go
  • Added SOT-23 (U) packge information to Pin Configuration and Functions sectionGo