ZHCSF94E February   2018  – July 2020 LMR23625

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fixed-Frequency Peak-Current-Mode Control
      2. 7.3.2 Adjustable Output Voltage
      3. 7.3.3 Enable/Sync
      4. 7.3.4 VCC, UVLO
      5. 7.3.5 Minimum ON-time, Minimum OFF-time and Frequency Foldback at Drop-out Conditions
      6. 7.3.6 Internal Compensation and CFF
      7. 7.3.7 Bootstrap Voltage (BOOT)
      8. 7.3.8 Overcurrent and Short-Circuit Protection
      9. 7.3.9 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
      3. 7.4.3 CCM Mode
      4. 7.4.4 Light Load Operation (PFM Option)
      5. 7.4.5 Light Load Operation (FPWM Option)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design With WEBENCH® Tools
        2. 8.2.2.2  Output Voltage Setpoint
        3. 8.2.2.3  Switching Frequency
        4. 8.2.2.4  Inductor Selection
        5. 8.2.2.5  Output Capacitor Selection
        6. 8.2.2.6  Feed-forward Capacitor
        7. 8.2.2.7  Input Capacitor Selection
        8. 8.2.2.8  Bootstrap Capacitor Selection
        9. 8.2.2.9  VCC Capacitor Selection
        10. 8.2.2.10 Undervoltage Lockout Set-Point
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Compact Layout for EMI Reduction
    4. 10.4 Ground Plane and Thermal Considerations
    5. 10.5 Feedback Resistors
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DRR|12
  • DDA|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.8 Typical Characteristics

Unless otherwise specified the following conditions apply: VIN = 12 V, fSW = 2100 kHz, L = 2.2 µH, COUT = 47 µF, TA = 25 °C.

GUID-057E7CFD-9C73-4199-BB55-4CEED456D75B-low.gif
fSW = 2100 kHz VOUT = 5 V
Figure 6-1 Efficiency vs Load Current
GUID-78DD862C-D336-41F1-B5B5-3CBF809BAE32-low.gif
fSW = 1000 kHz (Sync) VOUT = 5 V
Figure 6-3 Efficiency vs Load Current
GUID-720AB0B8-C37E-4CAF-9C16-0BF9E6E50D5D-low.gif
PFM Option VOUT = 5 V
Figure 6-5 Load Regulation
GUID-43B55AA3-80CF-4936-B61E-C5D182D928AD-low.gif
VOUT = 5 V
Figure 6-7 Dropout Curve
GUID-2D144DC2-E4C1-454C-B8CF-D24DC411ED39-low.gif
VIN = 12 V VFB = 1.1 V
Figure 6-9 IQ vs Junction Temperature
GUID-0D46E0DF-09F6-4DA4-9FFB-2718ACBB355C-low.gif
 
Figure 6-11 VIN UVLO Hysteresis vs Junction Temperature
GUID-0F57E7A3-4426-461D-9F1B-129577DE2B42-low.gif
fSW = 2100 kHz VOUT = 3.3 V
Figure 6-2 Efficiency vs Load Current
GUID-9A9B2916-A829-4D26-BF94-C154A6C6ED28-low.gif
fSW = 1000 kHz (Sync) VOUT = 3.3 V
Figure 6-4 Efficiency vs Load Current
GUID-0BE5433C-F38A-48BE-9CE3-E270A5CA3DEF-low.gif
FPWM Option VOUT = 5 V
Figure 6-6 Load Regulation
GUID-C56B74FE-B772-46B9-9471-3702672970EA-low.gif
VOUT = 3.3 V
Figure 6-8 Dropout Curve
GUID-B69FEB03-B44C-4641-B251-BF66D27D2F02-low.gif
 
Figure 6-10 VIN UVLO Rising Threshold vs Junction Temperature
GUID-89003891-0A09-44D0-A41D-D5E151E4049D-low.gif
VIN = 12 V
Figure 6-12 HS and LS Current Limit vs Junction Temperature