ZHCSP66A
october 2021 – april 2023
LMK1D1212
,
LMK1D1216
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Device Comparison Table
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Typical Characteristics
8
Parameter Measurement Information
9
Detailed Description
9.1
Overview
9.2
Functional Block Diagram
9.3
Feature Description
9.3.1
Fail-Safe Input and Hysteresis
9.3.2
Input Mux
9.4
Device Functional Modes
9.4.1
LVDS Output Termination
9.4.2
Input Termination
10
Application and Implementation
10.1
Application Information
10.2
Typical Application
10.2.1
Design Requirements
10.2.2
Detailed Design Procedure
10.2.3
Application Curves
10.3
Power Supply Recommendations
10.4
Layout
10.4.1
Layout Guidelines
10.4.2
Layout Examples
11
Device and Documentation Support
11.1
Documentation Support
11.1.1
Related Documentation
11.2
接收文档更新通知
11.3
支持资源
11.4
Trademarks
11.5
静电放电警告
11.6
术语表
12
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
RGZ|48
MPQF123F
散热焊盘机械数据 (封装 | 引脚)
RGZ|48
QFND014T
订购信息
zhcsp66a_oa
zhcsp66a_pm
10.4.2
Layout Examples
Figure 10-5
PCB layout example for LMK1D1212, Top Layer
Figure 10-6
PCB Layout Example for LMK1D1212, GND Layer