ZHCSJG9B March   2019  – August 2019 LMK00804B-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. Table 1. Absolute Maximum Ratings
    2. Table 2. ESD Ratings
    3. Table 3. Recommended Operating Conditions
    4. Table 4. Thermal Information
    5. Table 5. Power Supply Characteristics
    6. Table 6. LVCMOS / LVTTL DC Electrical Characteristics
    7. Table 7. Differential Input DC Electrical Characteristics
    8. Table 8. Switching Characteristics
    9. Table 9. Pin Characteristics
    10. 6.1      Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Clock Enable Timing
    4. 8.4 Device Functional Modes
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Output Clock Interface Circuit
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
          1. 9.2.1.3.1 System-Level Phase Noise and Additive Jitter Measurement
      2. 9.2.2 Input Detail
      3. 9.2.3 Input Clock Interface Circuits
    3. 9.3 Do's and Don'ts
      1. 9.3.1 Power Dissipation Calculations
      2. 9.3.2 Thermal Management
      3. 9.3.3 Recommendations for Unused Input and Output Pins
      4. 9.3.4 Input Slew Rate Considerations
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Considerations
      1. 10.1.1 Power-Supply Filtering
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Ground Planes
      2. 11.1.2 Power Supply Pins
      3. 11.1.3 Differential Input Termination
      4. 11.1.4 LVCMOS Input Termination
      5. 11.1.5 Output Termination
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9.3.1 Power Dissipation Calculations

The following power considerations refer to the device-consumed power consumption only. The device power consumption is the sum of static and dynamic power. The dynamic power usage consists of two components:

  • Power used by the device as it switches states
  • Power required to charge any output load

The output load can be capacitive-only or capacitive and resistive. Use Equation 3 through Equation 5 to calculate the power consumption of the device:

Equation 3. PDev = Pstat + Pdyn + PCload
Equation 4. Pstat = (IDD × VDD) + (IDDO × VDDO)
Equation 5. Pdyn + PCload = (IDDO,dyn + IDDO,Cload) × VDDO

where

  • IDDO,dyn = CPD × VDDO × f × n [mA]
  • IDDO,Cload = Cload × VDDO × f × n [mA]

Example for power consumption of the LMK00804B-Q1: 4 outputs are switching, f = 100 MHz,

VDD = VDDO = 3.465 V and assuming Cload = 5 pF per output:

Equation 6. PDev = 90 mW + 34 mW = 124 mW
Equation 7. Pstat = (21 mA × 3.465 V) + (5 mA × 3.465 V) = 90 mW
Equation 8. Pdyn + PCload = (2.8 mA + 6.9 mA) × 3.465 V = 34 mW
Equation 9. IDD,dyn = 2 pF × 3.465 V × 100 MHz × 4 = 2.8 mA
Equation 10. IDD,Cload = 5 pF × 3.465 V × 100 MHz × 4 = 6.9 mA

NOTE

For dimensioning the power supply, consider the total power consumption. The total power consumption is the sum of device power consumption and the power consumption of the load.