ZHCSPP6E May   2008  – July 2024 LMH6518

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Preamplifier
        1. 6.3.1.1 Primary Output Amplifier
        2. 6.3.1.2 Auxiliary Amplifier
      2. 6.3.2 Overvoltage Clamp
      3. 6.3.3 Attenuator
      4. 6.3.4 Digital Control Block
    4. 6.4 Device Functional Modes
      1. 6.4.1 Primary Amplifier
      2. 6.4.2 Auxiliary Output
    5. 6.5 Programming
      1. 6.5.1 Logic Functions
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Oscilloscope Front End
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Settings and ADC SPI Code (ECM)
          2. 7.2.1.2.2 Input and Output Considerations
            1. 7.2.1.2.2.1 Output Swing, Clamping, and Operation Beyond Full Scale
          3. 7.2.1.2.3 Oscilloscope Trigger Applications
        3. 7.2.1.3 Application Curves
      2. 7.2.2 JFET LNA Implementation
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
          1. 7.2.2.2.1 Attenuator Design
        3. 7.2.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 第三方产品免责声明
      2. 8.1.2 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 接收文档更新通知
    4. 8.4 支持资源
    5. 8.5 Trademarks
    6. 8.6 静电放电警告
    7. 8.7 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9 Revision History

Changes from Revision D (September 2016) to Revision E (July 2024)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • Updated text for clarity in Pin Configurations and Functions Go
  • Updated note 1 text for clarity in the Absolute Maximum Ratings Go
  • Added note 2 in the Absolute Maximum Ratings Go
  • Added new row for maximum dc output Absolute Maximum Ratings Go
  • Updated last sentence in paragraph for clarity in Layout Guidelines Go

Changes from Revision C (July 2013) to Revision D (September 2016)

  • 添加了 ESD 等级 表、特性说明 部分、器件功能模式、应用和实施 部分、电源相关建议 部分、布局 部分、器件和文档支持 部分以及机械、封装和可订购信息 部分Go
  • Added Thermal Information tableGo
  • Changed Y-axis unit on Output vs Input Typical Characteristics graphs From: (V) To: (mV)Go
  • Changed Y-axis unit on VOUT vs VIN Application Curves graph From: (V) To: (mV)Go

Changes from Revision A (March 2013) to Revision B (March 2013)

  • 将美国国家半导体数据表的布局更改为 TI 格式Go