SNOS926F May   1999  – September 2014 LM7372

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 ±15V DC Electrical Characteristics
    6. 6.6 ±15V AC Electrical Characteristics
    7. 6.7 ±5V DC Electrical Characteristics
    8. 6.8 ±5V AC Electrical Characteristics
  7. 7 Typical Performance Characteristics
  8. 8 Detailed Description
    1. 8.1 Functional Block Diagram
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
    3. 9.3 Application Details
      1. 9.3.1 High Frequency/Large Signal Swing Considerations
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DDA|8
  • D|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

NOTE

For SO PowerPAD package the exposed pad should be tied either to V− or left electrically floating. Die attach material is conductive and is internally tied to V−.
8-Pin SO PowerPAD
Package DDA
Top View
20004929.gif
16-Pin SOIC
Package D
Top View
snos_926_16_pin_diagram_v2.gif
* Heatsink Pins.(4)

Pin Functions

PIN I/O DESCRIPTION
NAME NUMBER
DDA D
* –– 1,8,9,16 –– Heatsink Pin
-IN A 2 4 I ChA Inverting Input
+IN A 3 5 I ChA Non-inverting Input
-IN B 6 12 I ChB Inverting Input
+IN B 5 11 I ChB Non-inverting Input
NC –– 2, 7, 10, 15 –– No Connection
OUT A 1 3 O Output A
OUT B 7 13 O Output B
V- 4 6 I Negative Supply
V+ 8 14 I Positive Supply