ZHCSL19C May   2019  – June 2021 LM61440

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Characteristics
    7. 7.7 Systems Characteristics
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  EN/SYNC Uses for Enable and VIN UVLO
      2. 8.3.2  EN/SYNC Pin Uses for Synchronization
      3. 8.3.3  Clock Locking
      4. 8.3.4  Adjustable Switching Frequency
      5. 8.3.5  PGOOD Output Operation
      6. 8.3.6  Internal LDO, VCC UVLO, and BIAS Input
      7. 8.3.7  Bootstrap Voltage and VCBOOT-UVLO (CBOOT Pin)
      8. 8.3.8  Adjustable SW Node Slew Rate
      9. 8.3.9  Spread Spectrum
      10. 8.3.10 Soft Start and Recovery From Dropout
      11. 8.3.11 Output Voltage Setting
      12. 8.3.12 Overcurrent and Short Circuit Protection
      13. 8.3.13 Thermal Shutdown
      14. 8.3.14 Input Supply Current
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Active Mode
        1. 8.4.3.1 CCM Mode
        2. 8.4.3.2 Auto Mode - Light Load Operation
          1. 8.4.3.2.1 Diode Emulation
          2. 8.4.3.2.2 Frequency Reduction
        3. 8.4.3.3 FPWM Mode - Light Load Operation
        4. 8.4.3.4 Minimum On-time (High Input Voltage) Operation
        5. 8.4.3.5 Dropout
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Choosing the Switching Frequency
        2. 9.2.2.2  Setting the Output Voltage
        3. 9.2.2.3  Inductor Selection
        4. 9.2.2.4  Output Capacitor Selection
        5. 9.2.2.5  Input Capacitor Selection
        6. 9.2.2.6  BOOT Capacitor
        7. 9.2.2.7  BOOT Resistor
        8. 9.2.2.8  VCC
        9. 9.2.2.9  BIAS
        10. 9.2.2.10 CFF and RFF Selection
        11. 9.2.2.11 External UVLO
      3. 9.2.3 Application Curves
      4. 9.2.4 USB Type-C System Example
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
        3. 9.2.4.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Ground and Thermal Considerations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

特性

  • 提供功能安全
  • 针对超低 EMI 要求进行了优化
    • HotRod™ 封装和并行输入路径可以尽可能减少开关节点振铃
    • 并行输入路径可更大限度减少寄生电感
    • 可调节 SW 节点上升时间
  • 专为可靠耐用的应用而设计
    • 支持 42V 的瞬态电压
    • ±1% 的总输出稳压精度
    • VOUT 可在 1V 至 95% 的 VIN 范围内调节
    • 在 3A 负载下具有 0.3V 压降(典型值)
  • 可在所有负载下进行高效电源转换
    • 在 13.5VIN、3.3VOUT 下具有 7µA 的无负载电流
    • 在 1mA、13.5VIN、5VOUT 下 PFM 效率为 83%
    • 低 MOSFET 导通电阻
      • RDS_ON_HS = 41mΩ(典型值)
      • RDS_ON_LS = 21mΩ(典型值)
    • 具有用于提升效率的外部偏置选项
  • 适用于可扩展电源
    • 与以下器件引脚兼容: