ZHCSP37F May   1999  – January 2022 LM567C

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Recommended Operating Conditions
    3. 7.3 Thermal Information
    4. 7.4 Electrical Characteristics
    5. 7.5 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Center Frequency
      2. 9.3.2 Output Filter
      3. 9.3.3 Loop Filter
      4. 9.3.4 Logic Output
      5. 9.3.5 Die Characteristics
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operation With Vi < 200m – VRMS
      2. 9.4.2 Operation With Vi > 200m – VRMS
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Touch-Tone Decoder
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Timing Components
          2. 10.2.1.2.2 Bandwidth
          3. 10.2.1.2.3 Output Filter
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Oscillator with Quadrature Output
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curve
      3. 10.2.3 Oscillator with Double Frequency Output
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedure
        3. 10.2.3.3 Application Curve
      4. 10.2.4 Precision Oscillator Drive 100-mA Loads
        1. 10.2.4.1 Design Requirements
        2. 10.2.4.2 Detailed Design Procedure
        3. 10.2.4.3 Application Curve
      5. 10.2.5 AC Test Circuit
        1. 10.2.5.1 Design Requirements
        2. 10.2.5.2 Detailed Design Procedure
        3. 10.2.5.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 接收文档更新通知
    2. 13.2 支持资源
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 术语表
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.3 Thermal Information

THERMAL METRIC(1)LM567CUNIT
D (SOIC)P (PDIP)
8 PINS
RθJAJunction-to-ambient thermal resistance107.553.0°C/W
RθJC(top)Junction-to-case (top) thermal resistance54.642.3
RθJBJunction-to-board thermal resistance47.530.2
ψJTJunction-to-top characterization parameter10.019.6
ψJBJunction-to-board characterization parameter47.030.1
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, (SPRA953).