ZHCSP37F May 1999 – January 2022 LM567C
PRODUCTION DATA
THERMAL METRIC(1) | LM567C | UNIT | ||
---|---|---|---|---|
D (SOIC) | P (PDIP) | |||
8 PINS | ||||
RθJA | Junction-to-ambient thermal resistance | 107.5 | 53.0 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 54.6 | 42.3 | |
RθJB | Junction-to-board thermal resistance | 47.5 | 30.2 | |
ψJT | Junction-to-top characterization parameter | 10.0 | 19.6 | |
ψJB | Junction-to-board characterization parameter | 47.0 | 30.1 |