SNVS608H June   2009  – September 2016 LM5009A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Control Circuit Overview
      2. 7.3.2 Start-Up Regulator (VCC)
      3. 7.3.3 Regulation Comparator
      4. 7.3.4 Overvoltage Comparator
      5. 7.3.5 ON-Time Generator and Shutdown
      6. 7.3.6 Current Limit
      7. 7.3.7 N-Channel Buck Switch and Driver
      8. 7.3.8 Thermal Protection
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  RFB1 and RFB2
        2. 8.2.2.2  Fs and RT
        3. 8.2.2.3  L1
          1. 8.2.2.3.1 Minimum Load Current
          2. 8.2.2.3.2 Maximum Load Current
        4. 8.2.2.4  C3
        5. 8.2.2.5  C2 and R3
        6. 8.2.2.6  ESR and R3
        7. 8.2.2.7  C2
        8. 8.2.2.8  RCL
        9. 8.2.2.9  D1
        10. 8.2.2.10 C1
        11. 8.2.2.11 C4
        12. 8.2.2.12 C5
        13. 8.2.2.13 Ripple Configuration
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VIN to GND –0.3 100 V
BST to GND –0.3 114 V
SW to GND (steady state) –1 V
BST to VCC 100 V
BST to SW 14 V
VCC to GND 14 V
All other inputs to GND –0.3 7 V
Storage temperature, Tstg –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VIN Input voltage 6 95 V
TJ Operating junction temperature –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) LM5009A UNIT
DGK (VSSOP) NGU (WSON)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 157.7 42.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 50.2 41.5 °C/W
RθJB Junction-to-board thermal resistance 77.9 20.1 °C/W
ψJT Junction-to-top characterization parameter 4.5 0.4 °C/W
ψJB Junction-to-board characterization parameter 76.5 20.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — 4.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

Typical values correspond to TJ = 25 ° C. Minimum and maximum limits apply over TJ = –40°C to 125°C for LM5009A. Unless otherwise stated, VIN = 48 V(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VCC SUPPLY
VCC Reg VCC regulator output(2) VIN = 48 V 6.6 7 7.4 V
VIN – VCC 6 V < VIN < 8.5 V 100 mV
VCC bypass threshold VIN increasing 8.5 V
VCC bypass hysteresis 300 mV
VCC output impedance VIN = 6 V 100 Ω
VIN = 10 V 8.8 Ω
VIN = 48 V 0.8 Ω
VCC current limit VIN = 48 V 9.2 mA
VCC UVLO VCC increasing 5.3 V
VCC UVLO hysteresis 190 mV
VCC UVLO filter delay 3 µs
Iin operating current FB = 3 V, VIN = 48 V 550 750 µA
Iin shutdown current RT/SD = 0 V 110 176 µA
CURRENT LIMIT
Current limit threshold 0.24 0.3 0.36 A
Current limit response time Iswitch overdrive = 0.1 A, time to switch off 350 ns
TOFF-1 OFF-time generator FB = 0 V, RCL = 100 K 35 µs
TOFF-2 OFF-time generator FB = 2.3 V, RCL = 100 K 2.56 µs
ON TIME GENERATOR
TON-1 ON-time generator VIN = 10 V, RON = 200 K 2.15 2.77 3.5 µs
TON-2 ON-time generator VIN = 95 V, RON = 200 K 200 300 420 ns
RT/SD Remote shutdown threshold Rising 0.4 0.7 1.05 V
RT/SD(HYS) Remote shutdown hysteresis 35 mV
MINIMUM OFF TIME
Minimum off timer FB = 0 V 300 ns
REGULATION AND OV COMPARATORS
FB reference threshold Internal reference, trip point for switch ON 2.445 2.5 2.55 V
FB overvoltage threshold Trip point for switch OFF 2.875 V
FB bias current 100 nA
THERMAL SHUTDOWN
TSD Thermal shutdown temperature 165 °C
Thermal shutdown hysteresis 25 °C
(1) All minimum and maximum limits are specified by correlating the electrical characteristics to process and temperature variations and applying statistical process control. The junction temperature (TJ in °C) is calculated from the ambient temperature (TA in °C) and power dissipation (PD in Watts) as follows: TJ = TA + (PD • RθJA ) where RθJA (in ° C/W) is the package thermal impedance provided in the Thermal Information section.
(2) The VCC output is intended as a self bias for the internal gate drive power and control circuits. Device thermal limitations limit external loading.

6.6 Switching Characteristics

Typical values correspond to TJ = 25 °C. Minimum and maximum limits apply over TJ = –40°C to 125°C for LM5009A. Unless otherwise stated, VIN = 48 V
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Buck switch RDS(ON)(1) Itest = 200 mA 2.2 4.6 Ω
Gate drive UVLO Vbst – Vsw rising 2.8 3.8 4.8 V
Gate drive UVLO hysteresis 490 mV
Precharge switch voltage At 1 mA 0.8 V
Precharge switch ON time 150 ns
(1) For devices procured in the 8-pin WSON package, the Rds(on) limits are specified by design characterization data only.

6.7 Typical Characteristics

LM5009A 30087124.png Figure 1. Efficiency vs Load Current and VIN
(Circuit of Figure 10)
LM5009A 30087125.png Figure 3. ON Time vs Input Voltage and RT
LM5009A 30087126.png Figure 5. Maximum Frequency vs VOUT and VIN
LM5009A 30087105.png Figure 2. VCC vs VIN
LM5009A 30087107.gif Figure 4. Current Limit OFF Time vs VFB and RCL
LM5009A 30087127.png Figure 6. ICC Current vs Applied VCC Voltage