SNVS090G May   2004  – June 2020 LM341

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Available Pinouts
      2.      Typical Application
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Recommended Operating Conditions
    3. 7.3 Thermal Information
    4. 7.4 Electrical Characteristics: LM341 (5 V) and LM78M05
    5. 7.5 Electrical Characteristics: LM341 (12 V)
    6. 7.6 Electrical Characteristics: LM341 (15 V)
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Operation
      2. 8.4.2 Operation With Low Input Voltage
      3. 8.4.3 Operation in Self Protection
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input Voltage
        2. 9.2.2.2 Output Current
        3. 9.2.2.3 Input Capacitor
        4. 9.2.2.4 Output Capacitor
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Thermal Considerations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.3 Thermal Information

THERMAL METRIC(1) LM341 LM78M05 UNIT
NDE (TO-220) NDP (TO-252) NDT (TO)
3 PINS 3 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance 22.6 38 162.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 17.8 48.4 23.9 °C/W
RθJB Junction-to-board thermal resistance 6 17.7 — °C/W
ψJT Junction-to-top characterization parameter 3.3 6.7 — °C/W
ψJB Junction-to-board characterization parameter 6 17.9 — °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.3 4.4 — °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.