SNVS778F May   1999  – May 2026 LM137 , LM337-N

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Thermal Regulation
    4. 6.4 Device Functional Modes
      1. 6.4.1 Protection Diodes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Adjustable Negative Voltage Regulator
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Adjustable Lab Voltage Regulator
      3. 7.2.3 Current Regulator
      4. 7.2.4 −5.2-V Regulator with Electronic Shutdown
      5. 7.2.5 High Stability −10-V Regulator
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
    3. 9.3 Thermal Considerations
      1. 9.3.1 Heatsinking SOT-223 Package Parts
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

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9.3.1 Heatsinking SOT-223 Package Parts

The SOT-223 DCY packages use a copper plane on the PCB and the PCB itself as a heatsink. To optimize the heat sinking ability of the plane and PCB, solder the tab of the package to the plane.

Figure 9-2 and Figure 9-3 show the information for the SOT-223 package. Figure 9-3 assumes a θ(J−A) of 75°C/W for 1 ounce copper and 51°C/W for 2 ounce copper and a maximum junction temperature of 125°C.

LM137 LM337-N θ(J−A) vs Copper (2 ounce) Area for the SOT-223 PackageFigure 9-2 θ(J−A) vs Copper (2 ounce) Area for the SOT-223 Package
LM137 LM337-N Maximum Power Dissipation vs TAMB for the SOT-223 PackageFigure 9-3 Maximum Power Dissipation vs TAMB for the SOT-223 Package

See AN-1028, SNVA036, for power enhancement techniques to be used with the SOT-223 package.