ZHCSOD7A February   2023  – September 2023 LM2101

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 功能方框图
    3. 7.3 Feature Description
      1. 7.3.1 Start-Up and UVLO
      2. 7.3.2 Input Stages
      3. 7.3.3 Level Shift
      4. 7.3.4 Output Stages
      5. 7.3.5 SH Transient Voltages Below Ground
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Select External Bootstrap Diode and Its Series Resistor
        2. 8.2.2.2 Select Bootstrap and GVDD Capacitor
        3. 8.2.2.3 Select External Gate Driver Resistor
        4. 8.2.2.4 Estimate the Driver Power Loss
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方产品免责声明
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 术语表
  13. 12Mechanical, Packaging, and Orderable Information

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|8
  • DSG|8
散热焊盘机械数据 (封装 | 引脚)

6.4 Thermal Information

THERMAL METRIC(1) LM2101 LM2101 UNIT
D (SOIC) DSG (WSON)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 133.2 78.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 75.2 97.7
°C/W
RθJB Junction-to-board thermal resistance 76.7 44.6
°C/W
ψJT Junction-to-top characterization parameter 25.5 4.6
°C/W
ψJB Junction-to-board characterization parameter 75.9 44.6
°C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 9.9
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.