SNVS528H October   2007  – January 2016 LM20143 , LM20143-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Peak Current Mode Control
      2. 7.3.2 Precision Enable
      3. 7.3.3 Current Limit
      4. 7.3.4 Pre-Bias Start Up Capability
      5. 7.3.5 Soft-Start and Voltage Tracking
      6. 7.3.6 Power Good and Overvoltage Fault Handling
      7. 7.3.7 UVLO
      8. 7.3.8 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Light Load Operation
      2. 7.4.2 Tracking an External Supply
      3. 7.4.3 Using Precision Enable and Power Good
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 3.3-V or 5-V Supply Rail Design
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Duty Cycle Calculation
          2. 8.2.1.2.2  Inductor Selection (L)
          3. 8.2.1.2.3  Output Capacitor Selection (COUT)
          4. 8.2.1.2.4  Input Capacitor Selection (CIN)
          5. 8.2.1.2.5  Setting the Output Voltage (RFB1, RFB2)
          6. 8.2.1.2.6  Adjusting the Operating Frequency (RT)
          7. 8.2.1.2.7  AVIN Filtering Components (CF and RF)
          8. 8.2.1.2.8  Sub-Regulator Bypass Capacitor (CVCC)
          9. 8.2.1.2.9  Setting the Start Up Time (CSS)
          10. 8.2.1.2.10 Loop Compensation (RC1, CC1)
        3. 8.2.1.3 Application Curves
      2. 8.2.2 5-V Supply Rail Design
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
      3. 8.2.3 3-V Supply Rail Design
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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订购信息

11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.1.2 Development Support

LM20143 Quickstart Design Tool, http://www.ti.com/tool/lm20143design-calc

11.2 Documentation Support

11.2.1 Related Documentation

For related documentation see the following:

  • AN-1691 LM20143 Evaluation Board, SNVA277
  • AN-2162: Simple Success with Conducted EMI from DC-DC Converters, SNVA489

11.3 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 10. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
LM20143 Click here Click here Click here Click here Click here
LM20143-Q1 Click here Click here Click here Click here Click here

11.4 Trademarks

PowerWise is a trademark of Texas Instruments.

WEBENCH is a registered trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.