ZHCSTG3H September   1999  – March 2024 LM1084

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Ripple Rejection
      2. 6.3.2 Load Regulation
      3. 6.3.3 Overload Recovery
    4. 6.4 Device Functional Modes
      1. 6.4.1 Output Voltage
      2. 6.4.2 Stability Consideration
      3. 6.4.3 Protection Diodes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1  1.2-V to 15-V Adjustable Regulator
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2  Adjustable at 5 V
      3. 7.2.3  5-V Regulator With Shutdown
      4. 7.2.4  Battery Charger
      5. 7.2.5  Adjustable Fixed Regulator
      6. 7.2.6  Regulator with Reference
      7. 7.2.7  High Current Lamp Driver Protection
      8. 7.2.8  Battery Backup Regulated Supply
      9. 7.2.9  Ripple Rejection Enhancement
      10. 7.2.10 Automatic Light Control
      11. 7.2.11 Generating Negative Supply Voltage
      12. 7.2.12 Remote Sensing
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Thermal Considerations
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 接收文档更新通知
    2. 8.2 支持资源
    3. 8.3 Trademarks
    4. 8.4 静电放电警告
    5. 8.5 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

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5.4 Thermal Information

THERMAL METRIC(2) LM1084 UNIT
KTT NDE
3 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance 40.4 22.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 42.6 15.5 °C/W
RθJB Junction-to-board thermal resistance 23.0 4.1 °C/W
ψJT Junction-to-top characterization parameter 9.8 2.1 °C/W
ψJB Junction-to-board characterization parameter 22.0 4.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance: Control section/Output section 0.65/2.7 0.65/2.7 °C/W
(2) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.