ZHCSET4B
December 2015 – April 2024
LDC0851
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Interface Voltage Levels
5.7
Timing Requirements
5.8
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
Basic Operation Mode
6.3.2
Threshold Adjust Mode
6.3.3
Setting the Threshold Adjust Values
6.3.4
Hysteresis
6.3.5
Conversion Time
6.3.6
Power-Up Conditions
6.4
Device Functional Modes
6.4.1
Shutdown Mode
6.4.2
Active Mode
7
Application and Implementation
7.1
Application Information
7.1.1
Sensor Design
7.1.1.1
Sensor Frequency
7.1.1.2
Sensor Design Procedure
7.2
Typical Application
7.2.1
Event Counting
7.2.1.1
Design Requirements
7.2.1.2
Detailed Design Procedure
7.2.1.3
Application Curves
7.2.2
Coarse Position Sensing
7.2.2.1
Design Requirements
7.2.2.2
Detailed Design Procedure
7.2.2.3
Application Curves
7.2.3
Low Power Operation
7.2.3.1
Design Requirements
7.2.3.2
Detailed Design Procedure
7.2.3.3
Application Curves
7.3
Power Supply Recommendations
7.4
Layout
7.4.1
Layout Guidelines
7.4.2
Layout Example
7.4.2.1
Side by Side Coils
7.4.2.2
Stacked Coils
8
Device and Documentation Support
8.1
Device Support
8.1.1
Development Support
8.2
Documentation Support
8.2.1
Related Documentation
8.3
支持资源
8.4
Trademarks
8.5
静电放电警告
8.6
术语表
9
Revision History
10
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
DSG|8
MPDS308C
散热焊盘机械数据 (封装 | 引脚)
DSG|8
QFND141I
订购信息
zhcset4b_oa
zhcset4b_pm
8.5
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。