ZHCSFJ4 September   2016 ISO5851-Q1

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史
  5. 说明 (续)
  6. Pin Configuration and Function
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Rating
    6. 7.6  Insulation Characteristics
    7. 7.7  Safety Limiting Values
    8. 7.8  Safety-Related Certifications
    9. 7.9  Electrical Characteristics
    10. 7.10 Switching Characteristics
    11. 7.11 Safety and Insulation Characteristics Curves
    12. 7.12 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Supply and active Miller clamp
      2. 9.3.2 Active Output Pull-down
      3. 9.3.3 Undervoltage Lockout (UVLO) with Ready (RDY) Pin Indication Output
      4. 9.3.4 Fault (FLT) and Reset (RST)
      5. 9.3.5 Short Circuit Clamp
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1  Recommended ISO5851-Q1 Application Circuit
        2. 10.2.2.2  FLT and RDY Pin Circuitry
        3. 10.2.2.3  Driving the Control Inputs
        4. 10.2.2.4  Local Shutdown and Reset
        5. 10.2.2.5  Global-Shutdown and Reset
        6. 10.2.2.6  Auto-Reset
        7. 10.2.2.7  DESAT Pin Protection
        8. 10.2.2.8  DESAT Diode and DESAT Threshold
        9. 10.2.2.9  Determining the Maximum Available, Dynamic Output Power, POD-max
        10. 10.2.2.10 Example
        11. 10.2.2.11 Higher Output Current Using an External Current Buffer
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 PCB Material
    3. 12.3 Layout Example
  13. 13器件和文档支持
    1. 13.1 文档支持
      1. 13.1.1 相关文档 
    2. 13.2 接收文档更新通知
    3. 13.3 社区资源
    4. 13.4 商标
    5. 13.5 静电放电警告
    6. 13.6 Glossary
  14. 14机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DW|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

Layout

Layout Guidelines

A minimum of four layers is required to accomplish a low EMI PCB design (see Figure 54). Layer stacking should be in the following order (top-to-bottom): high-current or sensitive signal layer, ground plane, power plane and low-frequency signal layer.

  • Routing the high-current or sensitive traces on the top layer avoids the use of vias (and the introduction of their inductances) and allows for clean interconnects between the gate driver and the microcontroller and power transistors. Gate driver control input, Gate driver output OUT and DESAT should be routed in the top layer.
  • Placing a solid ground plane next to the sensitive signal layer provides an excellent low-inductance path for the return current flow. On the driver side, use GND2 as the ground plane.
  • Placing the power plane next to the ground plane creates additional high-frequency bypass capacitance of approximately 100 pF/inch2. On the gate-driver VEE2 and VCC2 can be used as power planes. They can share the same layer on the PCB as long as they are not connected together.
  • Routing the slower speed control signals on the bottom layer allows for greater flexibility as these signal links usually have margin to tolerate discontinuities such as vias.

For more detailed layout recommendations, including placement of capacitors, impact of vias, reference planes, routing etc. see Application Note SLLA284, Digital Isolator Design Guide.

PCB Material

For digital circuit boards operating at less than 150 Mbps, (or rise and fall times greater than 1 ns), and trace lengths of up to 10 inches, use standard FR-4 UL94V-0 printed circuit board. This PCB is preferred over cheaper alternatives because of lower dielectric losses at high frequencies, less moisture absorption, greater strength and stiffness, and the self-extinguishing flammability-characteristics.

Layout Example

ISO5851-Q1 layout_sllsei6.gif Figure 54. Recommended Layer Stack