ZHCSID5E April   2018  – September 2019 ISO1410 , ISO1412 , ISO1430 , ISO1432 , ISO1450 , ISO1452

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     简化应用电路原理图
  4. 修订历史记录
  5. 说明 (续)
  6. Device Options
  7. Pin Configuration and Functions
    1.     Pin Functions: Full-Duplex Device
    2.     Pin Functions: Half-Duplex Device
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Power Ratings
    6. 8.6  Insulation Specifications
    7. 8.7  Safety-Related Certifications
    8. 8.8  Safety Limiting Values
    9. 8.9  Electrical Characteristics: Driver
    10. 8.10 Electrical Characteristics: Receiver
    11. 8.11 Supply Current Characteristics: Side 1 (ICC1)
    12. 8.12 Supply Current Characteristics: Side 2 (ICC2)
    13. 8.13 Switching Characteristics: Driver
    14. 8.14 Switching Characteristics: Receiver
    15. 8.15 Insulation Characteristics Curves
    16. 8.16 Typical Characteristics
  9. Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Electromagnetic Compatibility (EMC) Considerations
      2. 10.3.2 Failsafe Receiver
      3. 10.3.3 Thermal Shutdown
      4. 10.3.4 Glitch-Free Power Up and Power Down
    4. 10.4 Device Functional Modes
      1. 10.4.1 Device I/O Schematics
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1 Data Rate and Bus Length
        2. 11.2.2.2 Stub Length
        3. 11.2.2.3 Bus Loading
      3. 11.2.3 Application Curves
        1. 11.2.3.1 Insulation Lifetime
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
      1. 13.1.1 PCB Material
    2. 13.2 Layout Example
  14. 14器件和文档支持
    1. 14.1 文档支持
      1. 14.1.1 相关文档
    2. 14.2 相关链接
    3. 14.3 接收文档更新通知
    4. 14.4 社区资源
    5. 14.5 商标
    6. 14.6 静电放电警告
    7. 14.7 Glossary
  15. 15机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DW|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

修订历史记录

Changes from D Revision (May 2019) to E Revision

  • Added footnote to Pin functions table for NC pins Go
  • Changed certification information in Safety related certifications tableGo
  • Changed the Vth+ spec in Electrical characteristics: Receiver for -15 ≤ VCM ≤ 15 V from -20 mV to -10 mVGo
  • Added 1 line item for Vth+ in Electrical characteristics: Receiver for -7 ≤ VCM ≤ 12 VGo

Changes from C Revision (April 2019) to D Revision

  • Added 在整个数据表中添加了 B 器件编号 Go

Changes from B Revision (November 2018) to C Revision

  • Changed 将整个数据表中引用的 ISO141x 更改为 ISO14xxGo
  • Added 在“器件信息”表中添加了 ISO1430、ISO1432、ISO1450、ISO1452Go
  • Changed the position of Device Features tabels Go
  • Added footnote to Pin Functions: Full-Duplex DeviceGo
  • Added footnote to Pin Functions: Half-Duplex DeviceGo
  • Added Typical curves for ISO143x and ISO145x in Typical CharacteristicsGo
  • Added Section 11.2.3 Application Curves and Section 11.2.3.1 Insulation LifetimeGo

Changes from A Revision (August 2018) to B Revision

  • Changed 将状态更改为生产数据Go

Changes from * Revision (July 2018) to A Revision

  • Changed the designator of common mode voltage in Recommended operating condition to VIGo
  • Added test condition for CMTI in Electrical characteristics: Driver   Go
  • Added test condition for CMTI in Electrical characteristics: ReceiverGo
  • Changed VTEST to VCM in the Common Mode Transient Immunity (CMTI)—Full Duplex and Common Mode Transient Immunity (CMTI)—Half Duplex figures in the Parameter Measurement Information sectionGo
  • Changed tPLH to tPZH and tPLZ to tPHZ in the first Driver Enable and Disable Times timing diagram in the Parameter Measurement Information sectionGo
  • Added tPHZ to the first Receiver Enable and Disable Times timing diagram in the Parameter Measurement Information section Go