ZHCS078A June   2011  – August 2015 INA226

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Basic ADC Functions
        1. 7.3.1.1 Power Calculation
        2. 7.3.1.2 Alert Pin
    4. 7.4 Device Functional Modes
      1. 7.4.1 Averaging and Conversion Time Considerations
      2. 7.4.2 Filtering and Input Considerations
    5. 7.5 Programming
      1. 7.5.1 Programming the Calibration Register
      2. 7.5.2 Programming the Power Measurement Engine
        1. 7.5.2.1 Calibration Register and Scaling
      3. 7.5.3 Simple Current Shunt Monitor Usage (No Programming Necessary)
      4. 7.5.4 Default Settings
      5. 7.5.5 Bus Overview
        1. 7.5.5.1 Serial Bus Address
        2. 7.5.5.2 Serial Interface
        3. 7.5.5.3 Writing to and Reading from the INA226
          1. 7.5.5.3.1 High-Speed I2C Mode
        4. 7.5.5.4 SMBus Alert Response
    6. 7.6 Register Maps
      1. 7.6.1  Configuration Register (00h) (Read/Write)
      2. 7.6.2  Shunt Voltage Register (01h) (Read-Only)
      3. 7.6.3  Bus Voltage Register (02h) (Read-Only)
      4. 7.6.4  Power Register (03h) (Read-Only)
      5. 7.6.5  Current Register (04h) (Read-Only)
      6. 7.6.6  Calibration Register (05h) (Read/Write)
      7. 7.6.7  Mask/Enable Register (06h) (Read/Write)
      8. 7.6.8  Alert Limit Register (07h) (Read/Write)
      9. 7.6.9  Manufacturer ID Register (FEh) (Read-Only)
      10. 7.6.10 Die ID Register (FFh) (Read-Only)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 High-Side Sensing Circuit Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 器件和文档支持

11.1 器件支持

11.1.1 开发支持

  • 《INA226EVM 评估板和软件教程》（文献编号：SBOU113）

11.2 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.3 商标

E2E is a trademark of Texas Instruments.

I2C is a trademark of NXP Semiconductors.

All other trademarks are the property of their respective owners.

11.4 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.