ZHCSET2A November   2015  – January 2016 HDC1080

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 典型应用
  5. 修订历史记录
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Interface Electrical Characteristics
    7. 7.7 I2C Interface Timing Requirements
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Consumption
      2. 8.3.2 Voltage Supply Monitoring
      3. 8.3.3 Heater
    4. 8.4 Device Functional Modes
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
        1. 8.5.1.1 Serial Bus Address
        2. 8.5.1.2 Read and Write Operations
        3. 8.5.1.3 Device Measurement Configuration
    6. 8.6 Register Map
      1. 8.6.1 Temperature Register
      2. 8.6.2 Humidity Register
      3. 8.6.3 Configuration Register
      4. 8.6.4 Serial Number Registers
      5. 8.6.5 Manufacturer ID Register
      6. 8.6.6 Device Register ID
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Implementation and Usage Recommendations
      1. 9.3.1 Soldering
      2. 9.3.2 Chemical Exposure and Sensor Protection
      3. 9.3.3 High Temperature and Humidity Exposure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 Layout

11.1 Layout Guidelines

The Relative Humidity sensor element is located on the top side of the package.

It is recommended to isolate the sensor from the rest of the PCB by eliminating copper layers below the device (GND, VDD) and creating a slot into the PCB around the sensor to enhance thermal isolation.

11.2 Layout Example

The only component next to the device is the supply bypass capacitor. Since the relative humidity is dependent on the temperature, the HDC1080 should be positioned away from hot spots present on the board, such as a battery, display or micro-controller. Slots around the device can be used to reduce the thermal mass, for a quicker response to environmental changes. The DAP may be soldered to a floating pad on the board, but the board pad should NOT be connected to GND.

HDC1080 Layout.png Figure 18. Layout