ZHCSCP3B JULY   2014  – September 2015 HDC1000

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 典型应用
  5. 5 修订历史记录
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Interface Electrical Characteristics
    7. 7.7 I2C Interface Timing Requirements
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Consumption
      2. 8.3.2 Voltage Supply Monitoring
      3. 8.3.3 Heater
    4. 8.4 Device Functional Modes
    5. 8.5 Programming
      1. 8.5.1 I2C Serial Bus Address Configuration
      2. 8.5.2 I2C Interface
        1. 8.5.2.1 Serial Bus Address
        2. 8.5.2.2 Read and Write Operations
        3. 8.5.2.3 Device Measurement Configuration
    6. 8.6 Register Map
      1. 8.6.1 Temperature Register
      2. 8.6.2 Humidity Register
      3. 8.6.3 Configuration Register
      4. 8.6.4 Serial Number Registers
      5. 8.6.5 Manufacturer ID Register
      6. 8.6.6 Device Register ID
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Do's and Don'ts
      1. 9.3.1 Soldering
      2. 9.3.2 Recovery From Soldering
      3. 9.3.3 Chemical Exposure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Surface Mount
      2. 11.1.2 Stencil Printing Process
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档　
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 修订历史记录

Changes from A Revision (November 2014) to B Revision

  • Deleted 运行和功能温度范围参考。 Go
  • Added YPA 封装名称Go
  • Added Storage Temperature to Absolute Maximum Ratings table.Go
  • Changed Handling Ratings table title to ESD Ratings Go
  • Changed temperature range for the humidity sensor Go
  • Added RH to standard conditions Go
  • Changed RH accuracy Go
  • Added reference to Figure 2 for RH accuracy Go
  • Added condition for hysteresis spec Go
  • Changed the recommended operating range Go
  • Changed Figure 2 Go
  • Changed : register reference for battery monitoring was corrected Go
  • Added alternative recovery procedure for soldering Go
  • Added “社区资源”部分Go

Changes from * Revision (JULY 2014) to A Revision

  • Changed 数据表标题Go
  • Changed 说明Go
  • Changed package description Go
  • Added heater consumption Go
  • Changed overview Go
  • Added heater description Go
  • Added heater bit Go
  • Added application note Go
  • Changed application informationGo
  • Changed recovery from solderingGo