ZHCSB31C August   2011  – June 2014 DS90UR903Q-Q1 , DS90UR904Q-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Handling Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Recommended Serializer Timing for PCLK
    7. 6.7  Serial Control Bus AC Timing Specifications (SCL, SDA) - I2C Compliant (See )
    8. 6.8  Serial Control Bus DC Characteristics (SCL, SDA) - I2C Compliant
    9. 6.9  Serializer Switching Characteristics
    10. 6.10 Deserializer Switching Characteristics
    11. 6.11 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
      1. 7.2.1 Typical Application Diagram
      2. 7.2.2 Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Serial Frame Format
      2. 7.3.2 Signal Quality Enhancers
        1. 7.3.2.1 Des - Receiver Input Equalization (EQ)
      3. 7.3.3 Emi Reduction
        1. 7.3.3.1 Des - Receiver Staggered Output
        2. 7.3.3.2 Des Spread Spectrum Clocking
    4. 7.4 Device Functional Modes
      1. 7.4.1 LVCMOS VDDIO Option
      2. 7.4.2 Powerdown
      3. 7.4.3 Pixel Clock Edge Select (TRFB/RRFB)
    5. 7.5 Programming
      1. 7.5.1 Description of Serial Control Bus
      2. 7.5.2 ID[X] Address Decoder
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Typical Application Connection
        2. 8.2.2.2 AC Coupling
        3. 8.2.2.3 Power Up Requirements and PDB PIN
        4. 8.2.2.4 Transmission Media
        5. 8.2.2.5 Serial Interconnect Guidelines
        6. 8.2.2.6 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档　
    2. 11.2 相关链接
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 术语表
  12. 12机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from B Revision (April 2013) to C Revision

  • Added 更改了数据表流程和布局以符合全新的 TI 标准。 添加了以下部分：应用和实施；电源相关建议；布局；器件和文档支持；机械、封装和订购信息Go
  • Added additional thermal charateristicsGo
  • Changed test condition Vin to VddioGo
  • Added power up sequencing information and timing diagram.Go
  • Added application graphics of the serializer CML output.Go

Changes from A Revision (April 2013) to B Revision

  • Changed layout of National Data Sheet to TI formatGo