ZHCSCX8D April   2012  – October 2014 DS90UB925Q-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 DC Electrical Characteristics
    6. 6.6 AC Electrical Characteristics
    7. 6.7 Recommended Timing for the Serial Control Bus
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Charateristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  High Speed Forward Channel Data Transfer
      2. 7.3.2  Low Speed Back Channel Data Transfer
      3. 7.3.3  Backward Compatible Mode
      4. 7.3.4  Common Mode Filter Pin (CMF)
      5. 7.3.5  Video Control Signal Filter
      6. 7.3.6  EMI Reduction Features
        1. 7.3.6.1 Input SSC Tolerance (SSCT)
      7. 7.3.7  LVCMOS VDDIO Option
      8. 7.3.8  Power Down (PDB)
      9. 7.3.9  Remote Auto Power Down Mode
      10. 7.3.10 Input PCLK Loss Detect
      11. 7.3.11 Serial Link Fault Detect
      12. 7.3.12 Pixel Clock Edge Select (RFB)
      13. 7.3.13 Low Frequency Optimization (LFMODE)
      14. 7.3.14 Interrupt Pin — Functional Description And Usage (INTB)
      15. 7.3.15 Internal Pattern Generation
      16. 7.3.16 GPIO[3:0] and GPO_REG[8:4]
        1. 7.3.16.1 GPIO[3:0] Enable Sequence
        2. 7.3.16.2 GPO_REG[8:4] Enable Sequence
      17. 7.3.17 I2S Transmitting
        1. 7.3.17.1 Secondary I2S Channel
      18. 7.3.18 Built In Self Test (BIST)
        1. 7.3.18.1 BIST Configuration and Status
          1. 7.3.18.1.1 Sample BIST Sequence
        2. 7.3.18.2 Forward Channel And Back Channel Error Checking
    4. 7.4 Device Functional Modes
      1. 7.4.1 Configuration Select (MODE_SEL)
      2. 7.4.2 Repeater Application
        1. 7.4.2.1 Repeater Configuration
        2. 7.4.2.2 Repeater Connections
    5. 7.5 Programming
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Up Requirements and PDB Pin
    2. 9.2 CML Interconnect Guidelines
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档　
    2. 11.2 商标
    3. 11.3 静电放电警告
    4. 11.4 术语表
  12. 12机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

12 机械封装和可订购信息

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