ZHCSE02C March   2011  – March 2015 DP83848Q-Q1

PRODUCTION DATA.  

  1. 1 器件概述
    1. 1.1 特性
    2. 1.2 应用范围
    3. 1.3 说明
    4. 1.4 功能框图
  2. 2 修订历史记录
  3. 3 Pin Configuration and Functions
    1. 3.1  Pin Layout
    2. 3.2  Package Pin Assignments
    3. 3.3  Serial Management Interface
    4. 3.4  MAC Data Interface
    5. 3.5  Clock Interface
    6. 3.6  LED Interface
    7. 3.7  RESET
    8. 3.8  Strap Options
    9. 3.9  10 Mb/s and 100 Mb/s PMD Interface
    10. 3.10 Special Connections
    11. 3.11 Power Supply Pins
  4. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics: DC
    6. 4.6 Electrical Characteristics: AC
  5. 5 Detailed Description
    1. 5.1 Overview
    2. 5.2 Functional Block Diagram
    3. 5.3 Feature Description
      1. 5.3.1 Auto-Negotiation
        1. 5.3.1.1 Auto-Negotiation Pin Control
        2. 5.3.1.2 Auto-Negotiation Register Control
        3. 5.3.1.3 Auto-Negotiation Parallel Detection
        4. 5.3.1.4 Auto-Negotiation Restart
        5. 5.3.1.5 Enabling Auto-Negotiation via Software
        6. 5.3.1.6 Auto-Negotiation Complete Time
      2. 5.3.2 Auto-MDIX
      3. 5.3.3 LED Interface
        1. 5.3.3.1 LEDs
        2. 5.3.3.2 LED Direct Control
      4. 5.3.4 Internal Loopback
      5. 5.3.5 BIST
      6. 5.3.6 Energy Detect Mode
    4. 5.4 Device Functional Modes
      1. 5.4.1 MII Interface
        1. 5.4.1.1 Nibble-wide MII Data Interface
        2. 5.4.1.2 Collision Detect
        3. 5.4.1.3 Carrier Sense
      2. 5.4.2 Reduced MII Interface
      3. 5.4.3 802.3u MII Serial Management Interface
        1. 5.4.3.1 Serial Management Register Access
        2. 5.4.3.2 Serial Management Access Protocol
        3. 5.4.3.3 Serial Management Preamble Suppression
      4. 5.4.4 PHY Address
        1. 5.4.4.1 MII Isolate Mode
      5. 5.4.5 Half Duplex vs. Full Duplex
      6. 5.4.6 Reset Operation
        1. 5.4.6.1 Hardware Reset
        2. 5.4.6.2 Software Reset
    5. 5.5 Programming
      1. 5.5.1 Architecture
        1. 5.5.1.1 100BASE-TX Transmitter
          1. 5.5.1.1.1 Code-Group Encoding and Injection
          2. 5.5.1.1.2 Scrambler
          3. 5.5.1.1.3 NRZ to NRZI Encoder
          4. 5.5.1.1.4 Binary to MLT-3 Convertor
        2. 5.5.1.2 100BASE-TX Receiver
          1. 5.5.1.2.1  Analog Front End
          2. 5.5.1.2.2  Digital Signal Processor
            1. 5.5.1.2.2.1 Digital Adaptive Equalization and Gain Control
            2. 5.5.1.2.2.2 Base Line Wander Compensation
          3. 5.5.1.2.3  Signal Detect
          4. 5.5.1.2.4  MLT-3 to NRZI Decoder
          5. 5.5.1.2.5  NRZI to NRZ
          6. 5.5.1.2.6  Serial to Parallel
          7. 5.5.1.2.7  Descrambler
          8. 5.5.1.2.8  Code-group Alignment
          9. 5.5.1.2.9  4B/5B Decoder
          10. 5.5.1.2.10 100BASE-TX Link Integrity Monitor
          11. 5.5.1.2.11 Bad SSD Detection
        3. 5.5.1.3 10BASE-T Transceiver Module
          1. 5.5.1.3.1  Operational Modes
            1. 5.5.1.3.1.1 Half Duplex Mode
            2. 5.5.1.3.1.2 Full Duplex Mode
          2. 5.5.1.3.2  Smart Squelch
          3. 5.5.1.3.3  Collision Detection and SQE
          4. 5.5.1.3.4  Carrier Sense
          5. 5.5.1.3.5  Normal Link Pulse Detection and Generation
          6. 5.5.1.3.6  Jabber Function
          7. 5.5.1.3.7  Automatic Link Polarity Detection and Correction
          8. 5.5.1.3.8  Transmit and Receive Filtering
          9. 5.5.1.3.9  Transmitter
          10. 5.5.1.3.10 Receiver
    6. 5.6 Memory
      1. 5.6.1 Register Definition
        1. 5.6.1.1 Basic Mode Control Register (BMCR)
        2. 5.6.1.2 Basic Mode Status Register (BMSR)
        3. 5.6.1.3 PHY Identifier Register #1 (PHYIDR1)
        4. 5.6.1.4 PHY Identifier Register #2 (PHYIDR2)
        5. 5.6.1.5 Auto-Negotiation Advertisement Register (ANAR)
        6. 5.6.1.6 Auto-Negotiation Link Partner Ability Register (ANLPAR) (BASE Page)
        7. 5.6.1.7 Auto-Negotiation Link Partner Ability Register (ANLPAR) (Next Page)
        8. 5.6.1.8 Auto-Negotiate Expansion Register (ANER)
        9. 5.6.1.9 Auto-Negotiation Next Page Transmit Register (ANNPTR)
      2. 5.6.2 Extended Registers
        1. 5.6.2.1  PHY Status Register (PHYSTS)
        2. 5.6.2.2  False Carrier Sense Counter Register (FCSCR)
        3. 5.6.2.3  Receiver Error Counter Register (RECR)
        4. 5.6.2.4  100 Mb/s PCS Configuration and Status Register (PCSR)
        5. 5.6.2.5  RMII and Bypass Register (RBR)
        6. 5.6.2.6  LED Direct Control Register (LEDCR)
        7. 5.6.2.7  PHY Control Register (PHYCR)
        8. 5.6.2.8  10 Base-T Status/Control Register (10BTSCR)
        9. 5.6.2.9  CD Test and BIST Extensions Register (CDCTRL1)
        10. 5.6.2.10 Energy Detect Control (EDCR)
  6. 6 Application and Implementation
    1. 6.1 Application Information
    2. 6.2 Typical Application
      1. 6.2.1 Design Requirements
        1. 6.2.1.1 TPI Network Circuit
        2. 6.2.1.2 Clock IN (X1) Requirements
        3. 6.2.1.3 Power Feedback Circuit
        4. 6.2.1.4 Magnetics
      2. 6.2.2 Detailed Design Procedure
        1. 6.2.2.1 MAC Interface (MII/RMII)
        2. 6.2.2.2 Termination Requirement
        3. 6.2.2.3 Recommended Maximum Trace Length
        4. 6.2.2.4 Calculating Impedance
      3. 6.2.3 Application Curve
  7. 7 Power Supply Recommendations
  8. 8 Layout
    1. 8.1 Layout Guidelines
      1. 8.1.1 PCB Layout Considerations
      2. 8.1.2 PCB Layer Stacking
    2. 8.2 Layout Example
  9. 9 器件和文档支持
    1. 9.1 文档支持
      1. 9.1.1 相关文档
    2. 9.2 商标
    3. 9.3 静电放电警告
    4. 9.4 术语表
  10. 10机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Specifications

4.1 Absolute Maximum Ratings(1)(2)

MIN MAX UNIT
Supply Voltage (VCC) –0.5 4.2 V
DC Input Voltage (VIN) –0.5 VCC + 0.5 V
DC Output Voltage (VOUT) –0.5 VCC + 0.5 V
Maximum Case Temperature for TA = 105°C 115 °C
Maximum Die Temperature (TJ) 150 °C
Lead Temp. (TL) (Soldering, 10 sec.) 260 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications.

4.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002(1), (RZAP = 1.5k, CZAP = 100 pF) ±4000 V
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

4.3 Recommended Operating Conditions

MIN MAX UNIT
Supply voltage (VCC) 3.3 ± 0.3 V
Ambient Temperature (TA) –40 105 °C
Power Dissipation (PD) 267 mW

4.4 Thermal Information

THERMAL METRIC(1) DP83848Q-Q1 UNIT
RTA (WQFN)
40 PINS
RθJA Junction-to-ambient thermal resistance 34.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 21.1
RθJB Junction-to-board thermal resistance 40.5
ψJT Junction-to-top characterization parameter 0.4
ψJB Junction-to-board characterization parameter 10.5
RθJC(bot) Junction-to-case (bottom) thermal resistance 5.5
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4.5 Electrical Characteristics: DC

PARAMETER PIN
TYPES		 TEST CONDITIONS MIN TYP MAX UNIT
VIH Input High Voltage I, Nominal VCC 2 V
I/O
VIL Input Low Voltage I, 0.8 V
I/O
IIH Input High Current I, VIN = VCC 10 µA
I/O
IIL Input Low Current I, VIN = GND 10 µA
I/O
VOL Output Low O, IOL = 4 mA 0.4 V
Voltage I/O
VOH Output High O, IOH = –4 mA VCC - 0.5 V
Voltage I/O
IOZ TRI-STATE I/O, VOUT = VCC ±10 µA
Leakage O VOUT = GND
VTPTD_100 100M Transmit Voltage PMD Output Pair 0.95 1 1.05 V
VTPTDsym 100M Transmit Voltage Symmetry PMD Output Pair ±2%
VTPTD_10 10M Transmit Voltage PMD Output Pair 2.2 2.5 2.8 V
CIN1 CMOS Input I 5 pF
Capacitance
COUT1 CMOS Output O 5 pF
Capacitance
SDTHon 100BASE-TX PMD Input Pair 1000 mV diff pk-pk
Signal detect turn-on threshold
SDTHoff 100BASE-TX PMD Input Pair 200 mV diff pk-pk
Signal detect turn-off threshold
VTH1 10BASE-T Receive Threshold PMD Input Pair 585 mV
Idd100 100BASE-TX Supply 81 mA
(Full Duplex)
Idd10 10BASE-T Supply 92 mA
(Full Duplex)
Idd Power Down Mode Supply CLK_OUT disabled 14 mA

4.6 Electrical Characteristics: AC

PARAMETER DESCRIPTION NOTES MIN TYP MAX UNIT
POWER UP TIMING (SEE Figure 4-1)
T2.1.1  Post Power Up Stabilization time prior to MDC preamble for register accesses(1) MDIO is pulled high for 32-bit serial management initialization 167 ms
X1 Clock must be stable for a min. of 167ms at power up.
T2.1.2  Hardware Configuration Latch-in Time from power up(1) Hardware Configuration Pins are described in the Pin Description section. 167 ms
X1 Clock must be stable for a min. of 167ms at power up.
T2.1.3  Hardware Configuration pins transition to output drivers 50 ns
RESET TIMING (SEE Figure 4-2)
T2.2.1  Post RESET Stabilization time prior to MDC preamble for register accesses MDIO is pulled high for 32-bit serial management initialization 3 µs
T2.2.2  Hardware Configuration Latch-in Time from the Deassertion of RESET (either soft or hard)(2) Hardware Configuration Pins are described in Section 3.2 3 µs
T2.2.3  Hardware Configuration pins transition to output drivers 50 ns
T2.2.4  RESET pulse width X1 Clock must be stable for at min. of 1us during RESET pulse low time. 1 µs
MII SERIAL MANAGEMENT TIMING (SEE Figure 4-3)
T2.3.1  MDC to MDIO (Output) Delay Time 0 30 ns
T2.3.2  MDIO (Input) to MDC Setup Time 10 ns
T2.3.3  MDIO (Input) to MDC Hold Time 10 ns
T2.3.4  MDC Frequency 2.5 25 MHz
100-Mb/s MII TRANSMIT TIMING (SEE Figure 4-4)
T2.4.1  TX_CLK High/Low Time 100 Mb/s Normal mode 16 20 24 ns
T2.4.2  TXD[3:0], TX_EN Data Setup to TX_CLK 100 Mb/s Normal mode 10 ns
T2.4.3  TXD[3:0], TX_EN Data Hold from TX_CLK 100 Mb/s Normal mode 0 ns
100-Mb/s MII RECEIVE TIMING (SEE Figure 4-5)
T2.5.1  RX_CLK High/Low Time(3) 100 Mb/s Normal mode 16 20 24 ns
T2.5.2  RX_CLK to RXD[3:0], RX_DV, RX_ER Delay 100 Mb/s Normal mode 10 30 ns
100BASE-TX MII TRANSMIT PACKET LATENCY TIMING (SEE Figure 4-6)
T2.6.1  TX_CLK to PMD Output Pair Latency(4) 100BASE-TX modes bits
100BASE-TX TRANSMIT PACKET DEASSERTION TIMING (SEE Figure 4-7)
T2.7.1  TX_CLK to PMD Output Pair Deassertion(5) 100BASE-TX mode 5 bits
100BASE-TX TRANSMIT TIMING (tR/F AND JITTER) (SEE Figure 4-8)
T2.8.1  100 Mb/s PMD Output Pair tR and tF 3 4 5 ns
100 Mb/s tR and tF Mismatch(6)(7) 500 ps
T2.8.2  100 Mb/s PMD Output Pair Transmit Jitter 1.4 ns
100BASE-TX RECEIVE PACKET LATENCY TIMING (SEE Figure 4-9)
T2.9.1  Carrier Sense ON Delay(8)(9)(10) 100 Mb/s Normal mode 20 bits
T2.9.2  Receive Data Latency(9) 100 Mb/s Normal mode 24 bits
100BASE-TX RECEIVE PACKET DEASSERTION TIMING (SEE Figure 4-10)
T2.10.1  Carrier Sense OFF Delay(11)(12) 100 Mb/s Normal mode 24 bits
10-Mb/s MII TRANSMIT TIMING (SEE Figure 4-11)
T2.11.1  TX_CLK High/Low Time 10 Mb/s MII mode 190 200 210 ns
T2.11.2  TXD[3:0], TX_EN Data Setup to TX_CLK fall(13) 10 Mb/s MII mode 25 ns
T2.11.3  TXD[3:0], TX_EN Data Hold from TX_CLK rise(13) 10 Mb/s MII mode 0 ns
10-Mb/s MII RECEIVE TIMING (SEE Figure 4-12)
T2.12.1  RX_CLK High/Low Time(14) 160 200 240 ns
T2.12.2  RX_CLK TO RXD[3:0}, RX_DV Delay 10 Mb/s MII mode 100 ns
T2.12.3  RX_CLK rising edge delay from RXD[3:0], RX_DV Valid 10 Mb/s MII mode 100 ns
10BASE-T TRANSMIT TIMING (START OF PACKET) (SEE Figure 4-13)
T2.15.1  Transmit Output Delay from the Falling Edge of TX_CLK(15) 10 Mb/s MII mode 3.5 bits
10BASE-T TRANSMIT TIMING (END OF PACKET) (SEE Figure 4-14)
T2.16.1  End of Packet High Time (with '0' ending bit) 250 300 ns
T2.16.2  End of Packet High Time (with '1' ending bit) 250 300 ns
10BASE-T RECEIVE TIMING (START OF PACKET) (SEE Figure 4-15)
T2.17.1  Carrier Sense Turn On Delay (PMD Input Pair to CRS) 630 1000 ns
T2.17.2  RX_DV Latency(16)(17) 10 bits
T2.17.3  Receive Data Latency(17) Measurement shown from SFD 8 bits
10BASE-T RECEIVE TIMING (END OF PACKET) (SEE Figure 4-16)
T2.18.1  Carrier Sense Turn Off Delay 1 µs
10-Mb/s HEARTBEAT TIMING (SEE Figure 4-17)
T2.19.1  CD Heartbeat Delay 10 Mb/s half-duplex mode 1200 ns
T2.19.2  CD Heartbeat Duration 10 Mb/s half-duplex mode 1000 ns
10-Mb/s JABBER TIMING (SEE Figure 4-18)
T2.20.1  Jabber Activation Time 85 ms
T2.20.2  Jabber Deactivation Time 500 ms
10BASE-T NORMAL LINK PULSE TIMING (SEE Figure 4-19)
T2.21.1  Pulse Width 100 ns
T2.21.2  Pulse Period 16 ms
AUTO-NEGOTIATION FAST LINK PULSE (FLP) TIMING (SEE Figure 4-20)
T2.22.1  Clock, Data Pulse Width 100 ns
T2.22.2  Clock Pulse to Clock Pulse Period 125 µs
T2.22.3  Clock Pulse to Data Pulse Period Data = 1 62 µs
T2.22.4  Burst Width 2 ms
T2.22.5  FLP Burst to FLP Burst Period 16 ms
100BASE-TX SIGNAL DETECT TIMING (SEE Figure 4-21)
T2.23.1  SD Internal Turn-on Time 1 ms
T2.23.2  SD Internal Turn-off Time 350 µs
100-Mb/s INTERNAL LOOPBACK TIMING (SEE Figure 4-22)
T2.24.1  TX_EN to RX_DV Loopback(19)(18) 100 Mb/s internal loopback mode 240 ns
10-Mb/s INTERNAL LOOPBACK TIMING (SEE Figure 4-23)
T2.25.1  TX_EN to RX_DV Loopback(20) 10 Mb/s internal loopback mode 2 µs
RMII TRANSMIT TIMING (SEE Figure 4-24)
T2.26.1  X1 Clock Period 50 MHz Reference Clock 20 ns
T2.26.2  TXD[1:0], TX_EN, Data Setup to X1 rising 4 ns
T2.26.3  TXD[1:0], TX_EN, Data Hold from X1 rising 2 ns
T2.26.4  X1 Clock to PMD Output Pair Latency From X1 Rising edge to first bit of symbol 17 bits
RMII RECEIVE TIMING (SEE Figure 4-25)
T2.27.1  X1 Clock Period 50 MHz Reference Clock 20 ns
T2.27.2  RXD[1:0], CRS_DV, RX_DV and RX_ER output delay from X1 rising(21)(23) 2 14 ns
T2.27.3  CRS ON delay (100Mb) From JK symbol on PMD Receive Pair to initial assertion of CRS_DV(22) 18.5 bits
T2.27.4  CRS OFF delay (100Mb) From TR symbol on PMD Receive Pair to initial deassertion of CRS_DV(22) 27 bits
T2.27.5  RXD[1:0] and RX_ER latency (100Mb) From symbol on Receive Pair. Elasticity buffer set to default value (01) 38 bits
ISOLATION TIMING (SEE Figure 4-26)
T2.28.1  From software clear of bit 10 in the BMCR register to the transition from Isolate to Normal mode 100 µs
T2.28.2  From Deassertion of S/W or H/W Reset to transition from Isolate to Normal mode 500 µs
MHz_OUT TIMING (SEE Figure 4-27)
T2.29.1  25 MHz_OUT High/Low Time MII mode 20 ns
RMII mode 10 ns
T2.29.2  25 MHz_OUT propagation delay Relative to X1 8 ns
100-Mb/s X1 TO TX_CLK TIMING (SEE Figure 4-28)
T2.30.1  X1 to TX_CLK delay(24) 100 Mb/s Normal mode 0 5 ns
(1) In RMII Mode, the minimum Post Power up Stabilization and Hardware Configuration Latch-in times are 84ms.
(2) It is important to choose pull-up and/or pull-down resistors for each of the hardware configuration pins that provide fast RC time constants in order to latch-in the proper value prior to the pin transitioning to an output driver.
(3) RX_CLK may be held low or high for a longer period of time during transition between reference and recovered clocks. Minimum high and low times will not be violated.
(4) For Normal mode, latency is determined by measuring the time from the first rising edge of TX_CLK occurring after the assertion of TX_EN to the first bit of the “J” code group as output from the PMD Output Pair. 1 bit time = 10 ns in 100 Mb/s mode.
(5) Deassertion is determined by measuring the time from the first rising edge of TX_CLK occurring after the deassertion of TX_EN to the first bit of the “T” code group as output from the PMD Output Pair. 1 bit time = 10 ns in 100 Mb/s mode.
(6) Normal Mismatch is the difference between the maximum and minimum of all rise and fall times
(7) Rise and fall times taken at 10% and 90% of the +1 or -1 amplitude
(8) Carrier Sense On Delay is determined by measuring the time from the first bit of the “J” code group to the assertion of Carrier Sense.
(9) 1 bit time = 10 ns in 100 Mb/s mode.
(10) PMD Input Pair voltage amplitude is greater than the Signal Detect Turn-On Threshold Value.
(11) Carrier Sense Off Delay is determined by measuring the time from the first bit of the “T” code group to the deassertion of Carrier Sense.
(12) 1 bit time = 10 ns in 100 Mb/s mode.
(13) An attached Mac should drive the transmit signals using the positive edge of TX_CLK. As shown above, the MII signals are sampled on the falling edge of TX_CLK.
(14) RX_CLK may be held low for a longer period of time during transition between reference and recovered clocks. Minimum high and low times will not be violated.
(15) 1 bit time = 100 ns in 10 Mb/s.
(16) 10BASE-T RX_DV Latency is measured from first bit of preamble on the wire to the assertion of RX_DV
(17) 1 bit time = 100 ns in 10 Mb/s mode.
(18) Due to the nature of the descrambler function, all 100BASE-TX Loopback modes will cause an initial “dead-time” of up to 550 µs during which time no data will be present at the receive MII outputs. The 100BASE-TX timing specified is based on device delays after the initial 550µs “dead-time”.
(19) Measurement is made from the first rising edge of TX_CLK after assertion of TX_EN.
(20) Measurement is made from the first rising edge of TX_CLK after assertion of TX_EN.
(21) Per the RMII Specification, output delays assume a 25pF load.
(22) CRS_DV is asserted asynchronously in order to minimize latency of control signals through the Phy. CRS_DV may toggle synchronously at the end of the packet to indicate CRS deassertion.
(23) RX_DV is synchronous to X1. While not part of the RMII specification, this signal is provided to simplify recovery of receive data.
(24) X1 to TX_CLK timing is provided to support devices that use X1 instead of TX_CLK as the reference for transmit Mll data.
DP83848Q-Q1 30152520.png Figure 4-1 Power Up Timing
DP83848Q-Q1 30152521.png Figure 4-2 Reset Timing
DP83848Q-Q1 30152522.png Figure 4-3 MII Serial Management Timing
DP83848Q-Q1 30152523.png Figure 4-4 100 Mb/s MII Transmit Timing
DP83848Q-Q1 30152524.png Figure 4-5 100 Mb/s MII Receive Timing
DP83848Q-Q1 30152525.png Figure 4-6 100BASE-TX MII Transmit Packet Latency Timing
DP83848Q-Q1 30152526.png Figure 4-7 100BASE-TX Transmit Packet Deassertion Timing
DP83848Q-Q1 30152527.png Figure 4-8 100BASE-TX Transmit Timing (tR/F and Jitter)
DP83848Q-Q1 30152528.png Figure 4-9 100BASE-TX Receive Packet Latency Timing
DP83848Q-Q1 30152529.png Figure 4-10 100BASE-TX Receive Packet Deassertion Timing
DP83848Q-Q1 30152530.png Figure 4-11 10-Mb/s MII Transmit Timing
DP83848Q-Q1 30152531.png Figure 4-12 10-Mb/s MII Receive Timing
DP83848Q-Q1 30152534.gif Figure 4-13 10BASE-T Transmit Timing (Start of Packet)
DP83848Q-Q1 30152535.png Figure 4-14 10BASE-T Transmit Timing (End of Packet)
DP83848Q-Q1 30152536.gif Figure 4-15 10BASE-T Receive Timing (Start of Packet)
DP83848Q-Q1 30152537.png Figure 4-16 10BASE-T Receive Timing (End of Packet)
DP83848Q-Q1 30152538.png Figure 4-17 10-Mb/s Heartbeat Timing
DP83848Q-Q1 30152539.png Figure 4-18 10-Mb/s Jabber Timing
DP83848Q-Q1 30152540.png Figure 4-19 10BASE-T Normal Link Pulse Timing
DP83848Q-Q1 30152541.png Figure 4-20 Auto-Negotiation Fast Link Pulse (FLP) Timing
DP83848Q-Q1 30152542.png Figure 4-21 100BASE-TX Signal Detect Timing
DP83848Q-Q1 30152543.png Figure 4-22 100-Mb/s Internal Loopback Timing
DP83848Q-Q1 30152544.png Figure 4-23 10-Mb/s Internal Loopback Timing
DP83848Q-Q1 30152545.png Figure 4-24 RMII Transmit Timing
DP83848Q-Q1 30152546.png Figure 4-25 RMII Receive Timing
DP83848Q-Q1 30152549.png Figure 4-26 Isolation Timing
DP83848Q-Q1 30152550.png Figure 4-27 25 MHz_OUT Timing
DP83848Q-Q1 30152552.png Figure 4-28 100-Mb/s X1 to TX_CLK Timing