ZHCSIF8H 数据表 | 德州仪器 TI.com.cn

Note that there is one VCCK power ball located in the thermal ball array.

Figure 4-1 DLPC230 ZDQ Package
324-Pin BGA
Top View

Figure 4-2 DLPC231 ZEK Package
324-Pin BGA
Top View

Table 4-1 Pin Functions—Board Level Test, Debug, and Initialization

PIN			I/O⁽¹⁾	DESCRIPTION
NAME	ZDQ324	ZEK324	I/O⁽¹⁾	DESCRIPTION
RESETZ	F3	F3	I₇	Active low power-on reset for the DLPC23x-Q1. A low-to-high transition starts self-configuration and initialization of the ASIC. ('0' = Reset, '1' = Normal Operation) All ASIC power and input clocks must be stable before this reset is deasserted high. The signals listed below must be forced low by external pulldown, and will then be driven low as the power supplies stabilize with RESETZ asserted. PMIC_LEDSEL_0, PMIC_LEDSEL_1, PMIC_LEDSEL_2, PMIC_LEDSEL_3, DMD_DEN_ARSTZ, PMIC_AD3_CLK, and PMIC_AD3_MOSI All other bidirectional and output signals will be tristated while reset is asserted. External pullups or pulldowns must be added where necessary to protect external devices that can typically be driven by the ASIC to prevent device malfunction. This pin includes hysteresis. Specific timing requirements for this signal are shown in Section 5.12.
PMIC_PARKZ	E3	E4	I₇	DMD Park Control ('0' = Park, '1' = Un-Park) The TI TPS99000-Q1 device is used to control this signal. As part of this function, it monitors power to the DLPC23x-Q1 watching for an imminent power loss condition, upon which it will drive the PMIC_PARKZ signal accordingly. The specific timing requirements for this signal are shown in Section 5.12.
HOST_IF_SEL	R4	N1	B_13,14	Selects which input interface port will be used for Host Command and Control. The port that is not selected as the Host Command and Control port will be available as a Diagnostic Processor monitoring port. ('0' = Host SPI, '1' = Host I²C) This pin includes a weak internal pulldown. If a pullup is used to obtain a '1' value, the pullup value must be ≤ 8kΩ. Tristated while RESETZ is asserted low, and is sampled as a host directive approximately 1.5µs after RESETZ is deasserted. It can be driven as an output for TI debug use after sampling.
HOST_SPI_MODE	V1	P2	B_13,14	Selects the SPI mode (clock phase and polarity) that will be used with the HOST SPI interface. This value is applicable regardless of whether the Host SPI interface is used for Host Command and Control, or for the Diagnostic Processor monitoring port. ('0' = SPI Mode 0 or 3, '1' = SPI Mode 1 or 2) This pin includes a weak internal pulldown. If a pullup is used to obtain a '1' value, the pullup value must be ≤ 8kΩ. Tristated while RESETZ is asserted low, and is sampled as a host directive approximately 1.5µs after RESETZ is deasserted. It can be driven as an output for TI debug use after sampling.
RTPPUB_ENZ	AA3	U2	B_13,14	TI internal use. Must be left unconnected. Includes a weak pulldown
CRCZ_CHKSUM_SEL	AB3	V2	B_13,14	Selects whether the Host will use 8-bit CRC or checksum on the Host Command and Control interface. This value is only applicable for the Host Command and Control interface. The value for the Diagnostic Processor monitoring port will be specified in Flash. ('0' = 8-bit CRC, '1' = 8-bit checksum) This pin includes a weak internal pulldown. If a pullup is used to obtain a '1' value, the pullup value must be ≤ 8kΩ. Tristated while RESETZ is asserted low, and is sampled as a host directive approximately 1.5µs after RESETZ is deasserted. It can be driven as an output for TI debug use after sampling.
ETM_TRACECLK	AB6	R10	O₁₃	TI internal use. Must be left unconnected (clock for Trace Debug)
ETM_TRACECTL	AB7	R9	O₁₃	TI internal use. Must be left unconnected (control for Trace Debug)
TSTPT_0	Y4	R3	B_13,14	Test pin 0 / STAY-IN-BOOT: Selects whether the system must stay in the Boot Application, or proceed with the normal load of the Main Application. ('0' = Load Main Application, '1' = Stay in Boot Application) This pin includes a weak internal pulldown. If a pullup is being used to obtain a '1' value, the pullup value must be ≤ 8kΩ. Tristated while RESETZ is asserted low, and is sampled as a host directive approximately 1.5µs after RESETZ is deasserted. It can be driven as an output for debug use after sampling as described in Section 7.3.11.
TSTPT_1	AA4	R4	B_13,14	Test pin 1: This pin must be externally pulled down, left open or unconnected. Includes a weak pulldown. It can be driven as an output for debug use as described in Section 7.3.11.
TSTPT_2	Y5	R5	B_13,14	Test pin 2: This pin must be externally pulled down, left open or unconnected. Includes a weak pulldown. It can be driven as an output for debug use as described in Section 7.3.11.
TSTPT_3	AA5	R7	B_13,14	Test pin 3: This pin must be externally pulled down, left open or unconnected. Includes a weak pulldown. It can be driven as an output for debug use as described in Section 7.3.11.
TSTPT_4	Y6	P4	B_13,14	Test pin 4: This pin must be externally pulled down, left open or unconnected. Includes a weak pulldown. It can be driven as an output for debug use as described in Section 7.3.11.
TSTPT_5	AA6	R8	B_13,14	Test pin 5 / Spread Spectrum Disable: Selects whether spread spectrum flash settings are used or whether spread spectrum clocking will be disabled. ('0' = Spread Spectrum Disabled, '1' = Use flash Spread Spectrum settings) This pin includes a weak internal pulldown. If a pullup is being used to obtain a '1' value, the pullup value must be ≤ 8kΩ. This signal is tristated while RESETZ is asserted low, and is sampled as a host directive approximately 1.5µs after RESETZ is deasserted. It can be driven as an output for debug use after sampling as described in Section 7.3.11.
TSTPT_6	Y7	P6	B_13,14	Test pin 6: An external pullup resistor must be used (≤ 8kΩ because pin includes a weak pulldown). This signal is tristated while RESETZ is asserted low, and is sampled as a host directive approximately 1.5µs after RESETZ is deasserted. It can be driven as an output for debug use after sampling as described in Section 7.3.11.
TSTPT_7	AA7	P7	B_13,14	Test pin 7: This pin must be externally pulled down, left open or unconnected. Includes a weak pulldown. It can be driven as an output for debug use as described in Section 7.3.11.
HWTEST_EN	H3	J5	I₁₄	Manufacturing test enable signal. This signal must be connected directly to ground on the PCB. Includes a weak internal pulldown and hysteresis
JTAGTCK	G22	H17	I₁₁	JTAG Serial Data Clock Includes a weak internal pullup
JTAGTMS1	G21	H16	I₁₁	JTAG Test Mode Select Includes a weak internal pullup
JTAGTRSTZ	L20	G16	I₁₁	JTAG Reset Includes a weak internal pullup and Hysteresis. For normal operation, this pin must be pulled to ground through an external 8kΩ or less resistor. Failure to pull this pin low during normal operation will cause start-up and initialization problems. For JTAG Boundary Scan, this pin must be pulled-up or left disconnected.
JTAGTDI	K20	G17	I₁₁	JTAG Serial Data In Includes a weak internal pullup
JTAGTDO1	J20	G15	B_10,11	JTAG Serial Data Out Includes a weak internal pullup
JTAGTDO2	H20	F18	B_10,11	This pin must be left open or unconnected. Includes a weak internal pullup
JTAGTDO3	G20	F17	B_10,11	This pin must be left open or unconnected. Includes a weak internal pullup
JTAGTMS2	N20	H15	I₁₁	This pin must be left open or unconnected. Includes a weak internal pullup. See Section 7.3.11 for important debug access considerations.
JTAGTMS3	M20	G18	I₁₁	This pin must be left open or unconnected. Includes a weak internal pullup. See Section 7.3.11 for important debug access considerations.

(1) See Table 4-10 for more information on I/O definitions.

Table 4-2 Pin Functions—Parallel Port Input Data and Control

PIN ⁽¹⁾			I/O⁽²⁾	DESCRIPTION PARALLEL RGB MODE
NAME	ZDQ324	ZEK324	I/O⁽²⁾	DESCRIPTION PARALLEL RGB MODE
PCLK	R22	M18	I₁₁	Pixel clock
VSYNC	H21	J18	I₁₁	Vsync⁽³⁾
HSYNC	H22	H18	I₁₁	Hsync⁽³⁾
DATEN	P21	M17	I₁₁	Data Valid
				(TYPICAL RGB 888)
PDATA_0 PDATA_1 PDATA_2 PDATA_3 PDATA_4 PDATA_5 PDATA_6 PDATA_7	AA21 AA22 Y21 W21 Y22 V21 W22 U21	V17 U17 U18 T17 T18 R17 R18 P17	I₁₁	Blue (bit weight 1) Blue (bit weight 2) Blue (bit weight 4) Blue (bit weight 8) Blue (bit weight 16) Blue (bit weight 32) Blue (bit weight 64) Blue (bit weight 128)
				(TYPICAL RGB 888)
PDATA_8 PDATA_9 PDATA_10 PDATA_11 PDATA_12 PDATA_13 PDATA_14 PDATA_15	V22 T21 U22 R21 T22 P22 N21 N22	P18 N18 P16 N16 N17 M16 L18 L17	I₁₁	Green (bit weight 1) Green (bit weight 2) Green (bit weight 4) Green (bit weight 8) Green (bit weight 16) Green (bit weight 32) Green (bit weight 64) Green (bit weight 128)
				(TYPICAL RGB 888)
PDATA_16 PDATA_17 PDATA_18 PDATA_19 PDATA_20 PDATA_21 PDATA_22 PDATA_23	M22 M21 L22 L21 K22 K21 J22 J21	L16 K18 K17 K16 K15 J17 J16 J15	I₁₁	Red (bit weight 1) Red (bit weight 2) Red (bit weight 4) Red (bit weight 8) Red (bit weight 16) Red (bit weight 32) Red (bit weight 64) Red (bit weight 128)

(1) Unused inputs must be grounded or pulled down to ground through an external resistor (≤ 10kΩ).

(2) See Table 4-10 for more information on I/O definitions.

(3) VSYNC and HSYNC polarity are software programmable.

Table 4-3 Pin Functions—OpenLDI Ports Input Data and Control

PIN ⁽¹⁾⁽²⁾			I/O⁽³⁾	DESCRIPTION
NAME	ZDQ324	ZEK325	I/O⁽³⁾	DESCRIPTION
L1_CLK_P L1_CLK_N	AB11 AA11	V6 U6	I₁₈	OpenLDI (FPD Link I) Port 1 Clock Lane
L1_DATA0_P L1_DATA0_N L1_DATA1_P L1_DATA1_N L1_DATA2_P L1_DATA2_N L1_DATA3_P L1_DATA3_N	AB9 AA9 AB10 AA10 AB12 AA12 AB13 AA13	V4 U4 V5 U5 V7 U7 V8 U8	I₁₈	OpenLDI (FPD Link I) Port 1 Data Lanes: Intraport data lane swapping can be done on a product configuration basis to support board considerations.
L2_CLK_P L2_CLK_N	AB17 AA17	V12 U12	I₁₈	OpenLDI (FPD Link I) Port 2 Clock Lane
L2_DATA0_P L2_DATA0_N L2_DATA1_P L2_DATA1_N L2_DATA2_P L2_DATA2_N L2_DATA3_P L2_DATA3_N	AB15 AA15 AB16 AA16 AB18 AA18 AB19 AA19	V10 U10 V11 U11 V13 U13 V14 U14	I₁₈	OpenLDI (FPD Link I) Port 2 Data Lanes: Intraport data lane swapping can be done on a product configuration basis to support board considerations.

(1) The system only supports the operational use of one port. As two ports are available, the host can select which port they wish to be active (to optimize board routing as an example).

(2) The inputs for any unused ports must be left unconnected, and will be powered down by the system.

(3) See Table 4-10 for more information on I/O definitions.

Table 4-4 Pin Functions—DMD Reset and Bias Control Interfaces

PIN ⁽¹⁾⁽²⁾			I/O⁽³⁾	DESCRIPTION
NAME	ZDQ324	ZEK324	I/O⁽³⁾	DESCRIPTION
DMD_DEN_ARSTZ	D11	D9	O₁	DMD driver enable signal ('1' = Enabled, '0' = Reset) This signal will be driven low after the DMD is parked and before power is removed from the DMD. If the 1.8V power to the DLPC23x-Q1 is independent of the 1.8V power to the DMD, then an external pulldown resistor (≤ 2.2kΩ) must be used to hold the signal low in the event DLPC23x-Q1 power is inactive while DMD power is applied.
DMD_LS0_CLK	C11	C9	O₂	TI internal use. Must be left unconnected
DMD_LS0_WDATA	C10	D8	O₂	TI internal use. Must be left unconnected
DMD_LS0_RDATA	C9	C7	I₃	DMD, low-speed single-ended serial read data
DMD_LS1_RDATA	C8	C8	I₃	DMD, low-speed single-ended serial read data (Training data response for second port of DMD)
DMD_LS0_CLK_P DMD_LS0_CLK_N	B12 A12	B10 A10	O₄	DMD low-speed differential interface clock
DMD_LS0_WDATA_P DMD_LS0_WDATA_N	B11 A11	B9 A9	O₄	DMD low-speed differential interface write data

(1) The low-speed write control interface to the DMD is differential.

(2) All control interface reads will make use of the single-ended low-speed signals. The read data will be clocked by the write clock .

(3) See Table 4-10 for more information on I/O definitions.

Table 4-5 Pin Functions—DMD SubLVDS Interfaces

PIN			I/O⁽¹⁾	DESCRIPTION
NAME	ZDQ324	ZEK324	I/O⁽¹⁾	DESCRIPTION
DMD_HS0_CLK_P DMD_HS0_CLK_N	B17 A17	B15 A15	O₄	DMD high-speed interface, Port 0 Clock Lane.
DMD_HS0_WDATA0_P DMD_HS0_WDATA0_N DMD_HS0_WDATA1_P DMD_HS0_WDATA1_N DMD_HS0_WDATA2_P DMD_HS0_WDATA2_N DMD_HS0_WDATA3_P DMD_HS0_WDATA3_N DMD_HS0_WDATA4_P DMD_HS0_WDATA4_N DMD_HS0_WDATA5_P DMD_HS0_WDATA5_N DMD_HS0_WDATA6_P DMD_HS0_WDATA6_N DMD_HS0_WDATA7_P DMD_HS0_WDATA7_N	B21 A21 B20 A20 B19 A19 B18 A18 B16 A16 B15 A15 B14 A14 B13 A13	D17 D18 C17 C18 B17 A17 B16 A16 B14 A14 B13 A13 B12 A12 B11 A11	O₄	DMD high-speed interface, Port 0 Data Lanes: The true numbering and application of the DMD_HS_DATA pins are software configuration dependent as discussed in Section 7.3.3.
DMD_HS1_CLK_P DMD_HS1_CLK_N	B6 A6	B4 A4	O₄	DMD high-speed interface, Port 1 Clock Lane
DMD_HS1_WDATA0_P DMD_HS1_WDATA0_N DMD_HS1_WDATA1_P DMD_HS1_WDATA1_N DMD_HS1_WDATA2_P DMD_HS1_WDATA2_N DMD_HS1_WDATA3_P DMD_HS1_WDATA3_N DMD_HS1_WDATA4_P DMD_HS1_WDATA4_N DMD_HS1_WDATA5_P DMD_HS1_WDATA5_N DMD_HS1_WDATA6_P DMD_HS1_WDATA6_N DMD_HS1_WDATA7_P DMD_HS1_WDATA7_N	B2 A2 B3 A3 B4 A4 B5 A5 B7 A7 B8 A8 B9 A9 B10 A10	D2 D1 C2 C1 B2 A2 B3 A3 B5 A5 B6 A6 B7 A7 B8 A8	O₄	DMD high-speed interface, Port 1 Data Lanes: The true numbering and application of the DMD_HS_DATA pins are software configuration dependent as discussed in Section 7.3.3.

(1) See Table 4-10 for more information on I/O definitions.

Table 4-6 Pin Functions—Peripheral Interfaces

PIN			I/O⁽¹⁾	DESCRIPTION
NAME	ZDQ324	ZEK324	I/O⁽¹⁾	DESCRIPTION
HOST_IRQ⁽²⁾	T20	N15	O₁₀	Host interrupt (output active HIGH) This signal is used to indicate that the DLPC23x-Q1 has detected a serious error for which the ASIC has initiated an Emergency Shutdown. This is discussed further in Section 6.1. The DLPC23x-Q1 tristates this output during reset. An external pulldown (≤ 10kΩ) is required to drive this signal to its inactive state.
HOST_IIC_SCL	R20	M15	B₁₂	I²C Port, Host Command and Control to ASIC, SCL (bidirectional, open-drain): An external pullup is required.
HOST_IIC_SDA	P20	L15	B₁₂	I²C Port, Host Command and Control to ASIC, SDA (bidirectional, open-drain): An external pullup is required.
HOST_SPI_CLK	Y20	U16	I₁₁	SPI Port, Host Command and Control to ASIC, clock
HOST_SPI_CSZ	W20	T16	I₁₁	SPI Port, Host Command and Control to ASIC, chip select (active low input) An external pullup resistor (≤ 2.2kΩ) is required to avoid a floating chip select input to the ASIC.
HOST_SPI_DIN	V20	R16	I₁₁	SPI Port, Host Command and Control to ASIC, receive data in
HOST_SPI_DOUT	U20	P15	O₁₀	SPI Port, Host Command and Control to ASIC, transmit data out
FLSH_SPI_CSZ	Y1	T1	O₈	SPI Port, Control Interface to Flash device, chip select (active low output) An external pullup resistor (≤ 10kΩ) is required to avoid a floating chip select input to the Flash.
FLSH_SPI_CLK	W1	U1	O₈	SPI Port, Control Interface to Flash device, clock
FLSH_SPI_DIO_0	V2	P1	B_8,9	SPI Port, Control Interface to Flash device, transmit and receive data An external pullup resistor (≤ 10kΩ) is required.
FLSH_SPI_DIO_1	W2	R2	B_8,9	SPI Port, Control Interface to Flash device, transmit and receive data An external pullup resistor (≤ 10kΩ) is required.
FLSH_SPI_DIO_2	Y2	R1	B_8,9	SPI Port, Control Interface to Flash device, transmit and receive data An external pullup resistor (≤ 3.3kΩ) is required.
FLSH_SPI_DIO_3	W3	T2	B_8,9	SPI Port, Control Interface to Flash device, transmit and receive data An external pullup resistor (≤ 3.3kΩ) is required.
PMIC_INTZ⁽²⁾	G3	E2	I₇	TPS99000-Q1 interrupt (input with hysteresis) The ASIC provides a weak internal pullup.
PMIC_SPI_CLK	E1	F5	O₆	SPI Port, General Control Interface to TPS99000-Q1, clock
PMIC_SPI_CSZ0	E2	G4	O₆	SPI Port, General Control Interface to TPS99000-Q1, chip select 0 (active low output) An external pullup resistor (≤ 10kΩ) must be used to avoid floating chip select inputs to the external SPI device during ASIC reset assertion.
PMIC_SPI_DIN	F1	E3	I₇	SPI Port, General Control Interface to TPS99000-Q1, receive data in
PMIC_SPI_DOUT	D1	E5	O₆	SPI Port, General Control Interface to TPS99000-Q1, transmit data out
PMIC_AD3_CLK	H2	G1	O₂₀	Sequencer Clock / TPS99000-Q1 primary system clock An external pulldown resistor (≤ 10kΩ) must be used to avoid uncontrolled behavior during ASIC reset assertion.
PMIC_AD3_MISO	J2	G2	I₁₄	Measurement control interface to TPS99000-Q1, receive data in
PMIC_AD3_MOSI	J1	G3	O₂₀	Measurement control interface to TPS99000-Q1, transmit data out An external pulldown resistor (≤ 10kΩ) must be used to avoid uncontrolled behavior during ASIC reset assertion.
PMIC_LEDSEL_0	F2	F4	O₆	LED Control Interface to TPS99000-Q1 An external pulldown resistor (≤ 10kΩ) must be used to avoid uncontrolled illumination during ASIC reset assertion.
PMIC_LEDSEL_1	G1	E1	O₆	LED Control Interface to TPS99000-Q1 An external pulldown resistor (≤ 10kΩ) must be used to avoid uncontrolled illumination during ASIC reset assertion.
PMIC_LEDSEL_2	G2	F2	O₆	LED Control Interface to TPS99000-Q1 An external pulldown resistor (≤ 10kΩ) must be used to avoid uncontrolled illumination during ASIC reset assertion.
PMIC_LEDSEL_3	H1	F1	O₆	LED Control Interface to TPS99000-Q1 An external pulldown resistor (≤ 10kΩ) must be used to avoid uncontrolled illumination during ASIC reset assertion.
MSTR_SDA	AB5	T7	B₁₅	I²C Port, SDA. (bidirectional, open-drain) An external pullup is required. Typical use of the Master I²C port is communication with temperature sensing devices and an optional EEPROM. The Master I²C I/Os are powered by VCC3IO (3.3V only).
MSTR_SCL	AB4	R6	B₁₅	I²C Port, SCL. (bidirectional, open-drain) An external pullup is required. Typical use of the Master I²C port is communication with temperature sensing devices and an optional EEPROM. The Master I²C I/Os are powered by VCC3IO (3.3V only).

(1) See Table 4-10 for more information on I/O definitions.

(2) For more information about usage, see Section 6.1.

Table 4-7 Pin Functions—GPIO Peripheral Interface

PIN ⁽¹⁾⁽³⁾			I/O⁽²⁾	DESCRIPTION
NAME	ZDQ324	ZEK324	I/O⁽²⁾	DESCRIPTION
GPIO_31	D22	E15	B_20,14	General purpose I/O 31
GPIO_30	E21	E16	B_20,14	General purpose I/O 30
GPIO_29	E22	E17	B_20,14	General purpose I/O 29
GPIO_28	F20	E18	B_20,14	General purpose I/O 28
GPIO_27	F21	F15	B_20,14	General purpose I/O 27
GPIO_26	F22	F16	B_20,14	General purpose I/O 26
GPIO_25	V3	P3	B_20,14	General purpose I/O 25
GPIO_24	U3	M5	B_20,14	General purpose I/O 24
GPIO_23	U2	N4	B_20,14	General purpose I/O 23
GPIO_22	U1	N3	B_20,14	General purpose I/O 22
GPIO_21	T3	N2	B_20,14	General purpose I/O 21
GPIO_20	T2	M4	B_20,14	General purpose I/O 20
GPIO_19	T1	M3	B_20,14	General purpose I/O 19
GPIO_18	R3	M2	B_20,14	General purpose I/O 18
GPIO_17	R2	M1	B_20,14	General purpose I/O 17
GPIO_16	R1	L4	B_20,14	General purpose I/O 16
GPIO_15	P3	L3	B_20,14	General purpose I/O 15
GPIO_14	P2	L2	B_20,14	General purpose I/O 14
GPIO_13	P1	L1	B_20,14	General purpose I/O 13
GPIO_12	N3	K5	B_20,14	General purpose I/O 12
GPIO_11	N2	K4	B_20,14	General purpose I/O 11
GPIO_10	N1	K3	B_20,14	General purpose I/O 10
GPIO_09	M3	K2	B_20,14	General purpose I/O 09
GPIO_08	M2	K1	B_20,14	General purpose I/O 08
GPIO_07	M1	J4	B_20,14	General purpose I/O 07
GPIO_06	L3	J3	B_20,14	General purpose I/O 06
GPIO_05	L2	H2	B_20,14	General purpose I/O 05
GPIO_04	L1	H3	B_20,14	General purpose I/O 04
GPIO_03	K3	J2	B_20,14	General purpose I/O 03
GPIO_02	K2	H1	B_20,14	General purpose I/O 02
GPIO_01	K1	J1	B_20,14	General purpose I/O 01
GPIO_00	J3	H4	B_20,14	General purpose I/O 00

(1) Some GPIO signals are reserved for specific purposes. These signals vary per product configuration. These product allocations are discussed further in Section 7.3.7. All GPIO that are available for Host use must be configured as an input, a standard output, or an open-drain output. This is set in the flash configuration or by command using the Host command interface. The reset default for all GPIO is as an input signal. An external pullup (≤ 10kΩ) is required for each signal configured as open-drain.

(2) See Table 4-10 for more information on I/O definitions.

(3) All GPIO include hysteresis.

Table 4-8 Pin Functions—Clock and PLL Support

PIN			I/O⁽¹⁾	DESCRIPTION
NAME	ZDQ324	ZEK324	I/O⁽¹⁾	DESCRIPTION
PLL_REFCLK_I	D15	D12	I₁₇	Reference clock crystal input. If an external oscillator is used in place of a crystal, this pin must be left unconnected (floating with no added capacitive load).
PLL_REFCLK_O	D14	D13	B_16,17	Reference clock crystal return. If an external oscillator is used in place of a crystal, this pin must be used for the oscillator input.
OSC_BYPASS	D16	C13	I₁₉	Selects whether an external crystal or external oscillator will be used to drive the internal PLL. ('0' = Crystal, '1' = Oscillator) This pin includes a weak internal pulldown. If a pullup is used to obtain a '1' value, the pullup value must be ≤ 8kΩ.

(1) See Table 4-10 for more information on I/O definitions.

Table 4-9 Pin Functions—Power and Ground

PIN			I/O⁽¹⁾	DESCRIPTION
NAME	ZDQ324	ZEK324	I/O⁽¹⁾	DESCRIPTION
VCC18A_LVDS	B1, B22, C1, C22, D2, D3, D4, D5, D7, D18, D19, D20, D21, E20	B1, B18, C4, C6, C15, D3, D5, D14, D16, E13, F7, F8, F10, F12	PWR	1.8V Power for the differential High-Speed and Low-Speed DMD Interfaces
GND18A_LVDS	A1, A22, C2, C3, C4, C5, C6, C7, C16, C17, C18, C19, C20, C21, D8	A1, A18, C3, C5, C14, C16, D6, E8, E10, E12, E14, F6	RTN	1.8V GND for the differential High-Speed and Low-Speed DMD Interfaces
VCC18IO	D10	E9	PWR	1.8V Power for 1.8V IO
VCC3IO_MVGP	H4	G5, H5	PWR	3.3V Power for TPS99000-Q1 Interfaces
VCC3IO_FLSH	V4	N5, P5	PWR	3.3V Power for the Serial Flash Interface
VCC3IO_INTF	K19, L19, M19, R19, T19	H14, L14, J14, M14	PWR	3.3V Power for the Parallel Data, JTAG, and Host Command Interfaces
VCC3IO_COSC	C15	E11	PWR	3.3V I/O Power for the Crystal Oscillator
GNDIOLA_COSC	C14	C12	RTN	3.3V I/O GND for the Crystal Oscillator
VCC3IO	J4, K4, M4, N4, P4, W4, W5, G19	F14, G14, K6, L5, M6, N7, P8	PWR	3.3V I/O Power for all "other" I/O (such as GPIO, TSTPT, PMIC_AD3)
VCC33A_LVDS	W9, W13, W15, W19, Y9, Y13, Y15, Y19	T3, T4, T8, T10, R11, T12, R13, T14, R15, V16	PWR	3.3V I/O Power for the OpenLDI Interface
GND33A_LVDS	W14, Y14, AA8, AA14, AA20, AB8, AB14, AB20, AB21	R12, R14, T5, T6, T9, T11, T13, T15, U3, U9, U15, V3, V9, V15	RTN	3.3V I/O GND for the OpenLDI Interface
VCC11AD_PLLM	D13	D11	PWR	1.1V Analog/Digital Power for MCG (Master Clock Generator) PLL
GND11AD_PLLM	C13	C11	RTN	1.1V Analog/Digital GND for MCG (Master Clock Generator) PLL
VCC11AD_PLLD	D12	C10	PWR	1.1V Analog/Digital Power for DCG (DMD Clock Generator) PLL
GND11AD_PLLD	C12	D10	RTN	1.1V Analog/Digital GND for DCG (DMD Clock Generator) PLL
VCC11A_DDI_0	E19, F19	F13, G13	PWR	1.1V Filtered Core Power - External Filter Group A (HS DMD Interface 0)
VCC11A_DDI_1	E4, F4	E6, E7	PWR	1.1V Filtered Core Power - External Filter Group B (HS DMD Interface 1)
VCC11A_LVDS	W11, W12, W17, W18	N10, P11, P12, P13, P14	PWR	1.1V Filtered Core Power - External Filter Group C (OpenLDI Interface)
VCCK	G4, H19, (J11), J19, L4, N19, P19, T4, U4, U19, V19, W6, W8, W10, W16	F9, F11, G6, H13, K13, L6, J6, M13, N6, N8, N9, N11	PWR	1.1V Core Power (Ball numbers in parenthesis are also used as thermal ball and are located within the package center region)
GND	(J9, J10, J12, J13, J14, K9, K10, K11, K12, K13, K14, L9, L10, L11, L12, L13, L14, M9, M10, M11, M12, M13, M14, N9, N10, N11, N12, N13, N14, P9, P10, P11, P12, P13,P14), Y3, AA1, AA2, AB1, AB2, AB22, Y10, Y11, Y12, Y16, Y17, Y18	(G7, G8, G9, G10, G11, G12, H7, H8, H9, H10, H11, H12, J7, J8, J9, J10, J11, J12, K7, K8, K9, K10, K11, K12, L7, L8, L9, L10, L11, L12, M7, M8, M9, M10, M11, M12), H6, J13, K14, L13, N12, N13, N14, V1, V18	RTN	1.1V Core GND (Ball numbers in parenthesis are also used as thermal ball and are located within the package center region)
EFUSE_VDDQ	W7	P9		Manufacturing use only. Must be tied to ground
EFUSE_POR33	Y8	P10		Manufacturing use only. Must be tied to ground
RPI_0	D17	D15	I₅	Bandgap Reference for SubLVDS drivers (Supports DMD_HS0_xxxx). Requires a resistor (1% Tolerance) to GND18A_LVDS - Value specified in Table 8-4.
RPI_1	D6	D4	I₅	Bandgap Reference for SubLVDS drivers (Supports DMD_HS1_xxxx). Requires a resistor (1% Tolerance) to GND18A_LVDS - Value specified in Table 8-4.
RPI_LS	D9	D7	I₅	Bandgap References for SubLVDS drivers (Supports DMD_LS0_xxxx differential bus signals). Requires a resistor (1% Tolerance) to GND18A_LVDS - Value specified in Table 8-4.

(1) See Table 4-10 for more information on I/O definitions.

Table 4-10 I/O Type Subscript Definition

I/O⁽¹⁾		SUPPLY REFERENCE	ESD STRUCTURE
SUBSCRIPT	DESCRIPTION	SUPPLY REFERENCE	ESD STRUCTURE
1	1.8V LVCMOS Input	VCC18IO	ESD diode to GND and supply rail
2	1.8V LVCMOS Output	VCC18IO	ESD diode to GND and supply rail
3	1.8V LVCMOS Input	VCC18IO	ESD diode to GND and supply rail
4	1.8V SubLVDS Output	VCC18A_LVDS	ESD diode to GND and supply rail
5	1.8V SubLVDS Input	VCC18A_LVDS	ESD diode to GND and supply rail
6	3.3V LVCMOS Output	VCC3IO_MVGP	ESD diode to GND and supply rail
7	3.3V LVCMOS Input	VCC3IO_MVGP	ESD diode to GND and supply rail
8	3.3V LVCMOS Output	VCC3IO_FLSH	ESD diode to GND and supply rail
9	3.3V LVCMOS Input	VCC3IO_FLSH	ESD diode to GND and supply rail
10	3.3V LVCMOS Output	VCC3IO_INTF	ESD diode to GND and supply rail
11	3.3V LVCMOS Input	VCC3IO_INTF	ESD diode to GND and supply rail
12	3.3V I²C I/O	VCC3IO_INTF	ESD diode to GND and supply rail
13	3.3V LVCMOS Output	VCC3IO	ESD diode to GND and supply rail
14	3.3V LVCMOS Input	VCC3IO	ESD diode to GND and supply rail
15	3.3V I²C I/O with 3mA drive	VCC3IO	ESD diode to GND and supply rail
16	3.3V LVCMOS Output	VCC3IO_OSC	ESD diode to GND and supply rail
17	3.3V LVCMOS Input	VCC3IO_OSC	ESD diode to GND and supply rail
18	3.3V LVDS Input	VCC33A_LVDS	ESD diode to GND and supply rail
19	3.3V LVCMOS Input	VCC3IO_OSC	ESD diode to GND and supply rail
20	3.3V LVCMOS Output	VCC3IO	ESD diode to GND and supply rail
TYPE
I	Input	N/A
O	Output
B	Bidirectional
PWR	Power
RTN	Ground return

(1) External inputs (OLDI, Parallel RGB, GPIO, and so on) must not be driven until power supplies are valid.

Table 4-11 Internal Pullup and Pulldown Characteristics

INTERNAL PULLUP AND PULLDOWN RESISTOR CHARACTERISTICS ⁽¹⁾⁽²⁾	VCCIO	MIN	MAX	UNIT
Weak pullup resistance	3.3V	40	190	kΩ
Weak pulldown resistance	3.3V	30	190	kΩ

(1) The resistance is dependent on the supply voltage level applied to the I/O.

(2) An external 8kΩ or less pullup or pulldown (if needed) will work for any voltage condition to correctly override any associated internal pullups or pulldowns.

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机械数据 (封装 | 引脚)

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4 Pin Configuration and Functions