ZHCSG80F February   2006  – September 2016 DIX4192

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 RESET Operation
      2. 9.3.2 Master and Reference Clocks
      3. 9.3.3 Audio Serial Port Operation
      4. 9.3.4 Overview of the AES3 Digital Audio Interface Protocol
      5. 9.3.5 Digital Interface Transmitter (DIT) Operation
      6. 9.3.6 Digital Interface Receiver (DIR) Operation
      7. 9.3.7 General-Purpose Digital Outputs
      8. 9.3.8 Interrupt Output
    4. 9.4 Device Functional Modes
      1. 9.4.1 Host Interface Operation: Serial Peripheral Interface (SPI) Mode
      2. 9.4.2 Host Interface Operation: PHILIPS I2C Mode
    5. 9.5 Register Maps
      1. 9.5.1 Register and Data Buffer Organization
      2. 9.5.2 Control Registers
        1. 9.5.2.1 Registers 1F through 28: Q-Channel Sub-Code Data Registers
        2. 9.5.2.2 Registers 29 through 2C: IEC61937 PC/PD Burst Preamble
      3. 9.5.3 Channel Status and User Data Buffer Maps
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Digital Audio Transformer Vendors
      2. 10.1.2 Receiver Input Interfacing
      3. 10.1.3 Transmitter Output Interfacing
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Differential Line Inputs and Output
        2. 10.2.2.2 Serial Ports
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 器件支持
      1. 13.1.1 Third-Party Products Disclaimer
      2. 13.1.2 开发支持
    2. 13.2 文档支持
      1. 13.2.1 相关文档
    3. 13.3 接收文档更新通知
    4. 13.4 社区资源
    5. 13.5 商标
    6. 13.6 静电放电警告
    7. 13.7 Glossary
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

13 器件和文档支持

13.1 器件支持

13.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

13.1.2 开发支持

相关开发支持请参阅以下文档：

13.2 文档支持

13.2.1 相关文档

相关文档如下：

13.3 接收文档更新通知

如需接收文档更新通知，请访问 www.ti.com.cn 网站上的器件产品文件夹。点击右上角的提醒我 (Alert me) 注册后，即可每周定期收到已更改的产品信息。有关更改的详细信息，请查阅已修订文档中包含的修订历史记录。

13.4 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.5 商标

E2E is a trademark of Texas Instruments.

Dolby is a registered trademark of Dolby Laboratories, Inc.

SPI is a trademark of Motorola.

I2S is a trademark of NXP Semiconductors.

All other trademarks are the property of their respective owners.

13.6 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

13.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.