SLAS719E August   2010  – June 2015 DAC7562 , DAC7563 , DAC8162 , DAC8163 , DAC8562 , DAC8563

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
      1. 7.7.1 Typical Characteristics: Internal Reference
      2. 7.7.2 Typical Characteristics: DAC at AVDD = 5.5 V
      3. 7.7.3 Typical Characteristics: DAC at AVDD = 3.6 V
      4. 7.7.4 Typical Characteristics: DAC at AVDD = 2.7 V
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Digital-to-Analog Converter (DAC)
        1. 8.3.1.1 Resistor String
        2. 8.3.1.2 Output Amplifier
      2. 8.3.2 Internal Reference
      3. 8.3.3 Power-On Reset
        1. 8.3.3.1 Power-On Reset to Zero-Scale
        2. 8.3.3.2 Power-On Reset to Mid-Scale
        3. 8.3.3.3 Power-On Reset (POR) Levels
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Modes
        1. 8.4.1.1 DAC Power-Down Commands
      2. 8.4.2 Gain Function
      3. 8.4.3 Software Reset Function
      4. 8.4.4 Internal Reference Enable Register
        1. 8.4.4.1 Enabling Internal Reference
        2. 8.4.4.2 Disabling Internal Reference
      5. 8.4.5 CLR Functionality
      6. 8.4.6 LDAC Functionality
    5. 8.5 Programming
      1. 8.5.1 SYNC Interrupt
      2. 8.5.2 DAC Register Configuration
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 DAC Internal Reference
        1. 9.1.1.1 Supply Voltage
        2. 9.1.1.2 Temperature Drift
        3. 9.1.1.3 Noise Performance
        4. 9.1.1.4 Load Regulation
          1. 9.1.1.4.1 Long-Term Stability
        5. 9.1.1.5 Thermal Hysteresis
      2. 9.1.2 DAC Noise Performance
    2. 9.2 Typical Applications
      1. 9.2.1 Combined Voltage and Current Analog Output Module Using the XTR300
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Up to ±15-V Bipolar Output Using the DAC8562
    3. 9.3 System Examples
      1. 9.3.1 MSP430 Microprocessor Interfacing
      2. 9.3.2 TMS320 McBSP Microprocessor Interfacing
      3. 9.3.3 OMAP-L1x Processor Interfacing
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most-current data available for the designated devices. This data is subject to change without notice and without revision of this document. For browser-based versions of this data sheet, see the left-hand navigation pane.