ZHCSIG8A July   2018  – November 2018 DAC61408 , DAC71408 , DAC81408

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      功能方框图
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Digital-to-Analog Converters (DACs) Architecture
        1. 9.3.1.1 DAC Transfer Function
        2. 9.3.1.2 DAC Register Structure
          1. 9.3.1.2.1 DAC Register Synchronous and Asynchronous Updates
          2. 9.3.1.2.2 Broadcast DAC Register
          3. 9.3.1.2.3 Clear DAC Operation
      2. 9.3.2 Internal Reference
      3. 9.3.3 Device Reset Options
        1. 9.3.3.1 Power-on-Reset (POR)
        2. 9.3.3.2 Hardware Reset
        3. 9.3.3.3 Software Reset
      4. 9.3.4 Thermal Protection
        1. 9.3.4.1 Analog Temperature Sensor: TEMPOUT Pin
        2. 9.3.4.2 Thermal Shutdown
    4. 9.4 Device Functional Modes
      1. 9.4.1 Toggle Mode
      2. 9.4.2 Differential Mode
      3. 9.4.3 Power-Down Mode
    5. 9.5 Programming
      1. 9.5.1 Stand-Alone Operation
        1. 9.5.1.1 Streaming Mode Operation
      2. 9.5.2 Daisy-Chain Operation
      3. 9.5.3 Frame Error Checking
    6. 9.6 Register Maps
      1. 9.6.1  NOP Register (Offset = 00h) [reset = 0000h]
        1. Table 9. NOP Register Field Descriptions
      2. 9.6.2  DEVICEID Register (Offset = 01h) [reset = ----h]
        1. Table 10. DEVICEID Register Field Descriptions
      3. 9.6.3  STATUS Register (Offset = 02h) [reset = 0000h]
        1. Table 11. STATUS Register Field Descriptions
      4. 9.6.4  SPICONFIG Register (Offset = 03h) [reset = 0A24h]
        1. Table 12. SPICONFIG Register Field Descriptions
      5. 9.6.5  GENCONFIG Register (Offset = 04h) [reset = 7F00h]
        1. Table 13. GENCONFIG Register Field Descriptions
      6. 9.6.6  BRDCONFIG Register (Offset = 05h) [reset = FFFFh]
        1. Table 14. BRDCONFIG Register Field Descriptions
      7. 9.6.7  SYNCCONFIG Register (Offset = 06h) [reset = 0000h]
        1. Table 15. SYNCCONFIG Register Field Descriptions
      8. 9.6.8  TOGGCONFIG0 Register (Offset = 07h) [reset = 0000h]
        1. Table 16. TOGGCONFIG0 Register Field Descriptions
      9. 9.6.9  TOGGCONFIG1 Register (Offset = 08h) [reset = 0000h]
        1. Table 17. TOGGCONFIG1 Register Field Descriptions
      10. 9.6.10 DACPWDWN Register (Offset = 09h) [reset = FFFFh]
        1. Table 18. DACPWDWN Register Field Descriptions
      11. 9.6.11 DACRANGEn Register (Offset = 0Bh - 0Ch) [reset = 0000h]
        1. Table 19. DACRANGEn Register Field Descriptions
      12. 9.6.12 TRIGGER Register (Offset = 0Eh) [reset = 0000h]
        1. Table 20. TRIGGER Register Field Descriptions
      13. 9.6.13 BRDCAST Register (Offset = 0Fh) [reset = 0000h]
        1. Table 21. BRDCAST Register Field Descriptions
      14. 9.6.14 DACn Register (Offset = 14h - 1Bh) [reset = 0000h]
        1. Table 22. DACn Register Field Descriptions
      15. 9.6.15 OFFSETn Register (Offset = 21h - 22h) [reset = 0000h]
        1. Table 23. OFFSETn Register Field Descriptions
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure for Remote Ground Tracking
        1. 10.2.2.1 Generating 300mV Offset
        2. 10.2.2.2 Amplifier Selection
        3. 10.2.2.3 Passive Component Selection
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 文档支持
    2. 13.2 相关链接
    3. 13.3 接收文档更新通知
    4. 13.4 社区资源
    5. 13.5 商标
    6. 13.6 静电放电警告
    7. 13.7 术语表
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage VDD to GND -0.3 6 V
VIO to GND -0.3 6 V
VCC to GND -0.3 44 V
VSS to GND -22 0.3 V
REFGND to GND -0.3 0.9 V
VDD to VAA -0.3 0.3 V
VCC to VSS -0.3 44 V
Pin voltage DAC outputs to GND VSS - 0.3 VCC + 0.3 V
TEMPOUT to GND -0.3 VDD + 0.3 V
REF and REFCMP to GND -0.3 VDD + 0.3 V
Digital inputs to GND -0.3 VIO + 0.3 V
SDO to GND -0.3 VIO + 0.3 V
ALARMOUT to GND -0.3 6 V
Operating junction temperature, TJ -40 150 °C
Storage temperature, Tstg -60 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.