ZHCSEO3B April   2012  – January 2016 DAC101C081 , DAC101C081Q , DAC101C085

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 AC and Timing Characteristics
    7. 8.7 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 DAC Section
      2. 9.3.2 Output Amplifier
      3. 9.3.3 Reference Voltage
      4. 9.3.4 Power-On Reset
      5. 9.3.5 Simultaneous Reset
      6. 9.3.6 Additional Timing Information: toutz
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power-Down Modes
    5. 9.5 Programming
      1. 9.5.1 Serial Interface
      2. 9.5.2 Basic I2C™ Protocol
      3. 9.5.3 Standard-Fast Mode
      4. 9.5.4 High-Speed (Hs) Mode
      5. 9.5.5 I2C Slave (Hardware) Address
      6. 9.5.6 Writing to the DAC Register
      7. 9.5.7 Reading from the DAC Register
    6. 9.6 Registers
      1. 9.6.1 DAC Register
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Bipolar Operation
      2. 10.1.2 DSP/Microprocessor Interfacing
        1. 10.1.2.1 Interfacing to the 2-wire Bus
        2. 10.1.2.2 Interfacing to a Hs-mode Bus
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
    1. 11.1 Using References as Power Supplies
      1. 11.1.1 LM4132
      2. 11.1.2 LM4050
      3. 11.1.3 LP3985
      4. 11.1.4 LP2980
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 器件支持
      1. 13.1.1 器件命名规则
        1. 13.1.1.1 技术规格定义
    2. 13.2 相关链接
    3. 13.3 社区资源
    4. 13.4 商标
    5. 13.5 静电放电警告
    6. 13.6 Glossary
  14. 14机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from A Revision (March 2013) to B Revision

  • 已添加 ESD 额定值表，特性 描述部分，器件功能模式，应用和实施部分，电源相关建议部分，布局部分，器件和文档支持部分以及机械、封装和可订购信息部分。Go
  • Added addresses that the DAC responds to on the I2C bus.Go

Changes from * Revision (March 2013) to A Revision

  • Changed layout of National Data Sheet to TI formatGo