ZHCSCC0A
April 2014 – July 2015
CSD95372BQ5MC
PRODUCTION DATA.
1
特性
2
应用
3
说明
Device Images
4
修订历史记录
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
7
Application Schematic
8
器件和文档支持
8.1
社区资源
8.2
商标
8.3
静电放电警告
8.4
Glossary
9
机械、封装和可订购信息
9.1
机械制图
9.2
建议印刷电路板 (PCB) 焊盘图案
9.3
建议模板开口
封装选项
机械数据 (封装 | 引脚)
DMC|12
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcscc0a_oa
zhcscc0a_pm
6.4
Thermal Information
T
A
= 25°C (unless otherwise noted)
THERMAL METRIC
MIN
TYP
MAX
UNIT
R
θJC(top)
Junction-to-case (top of package) thermal resistance
(1)
5
°C/W
R
θJB
Junction-to-board thermal resistance
(2)
1.5
°C/W
(1)
R
θJC(top)
is determined with the device mounted on a 1-in
2
(6.45-cm
2
), 2-oz (0.071-mm) thick Cu pad on a 1.5-in x 1.5-in, 0.06-in (1.52-mm) thick FR4 board.
(2)
R
θJB
value based on hottest board temperature within 1 mm of the package.