ZHCSFX7B November   2016  – November 2022 CSD18510KTT

PRODUCTION DATA  

  1. 1特性
  2. 2应用
  3. 3说明
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6器件和文档支持
    1. 6.1 接收文档更新通知
    2. 6.2 支持资源
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 术语表
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 KTT Package Dimensions
    2. 7.2 Recommended PCB Pattern
    3. 7.3 Recommended Stencil Opening (0.125 mm Stencil Thickness)

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • KTT|2
散热焊盘机械数据 (封装 | 引脚)
订购信息

Electrical Characteristics

TA = 25°C (unless otherwise stated)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
STATIC CHARACTERISTICS
BVDSSDrain-to-source voltageVGS = 0 V, ID = 250 μA40V
IDSSDrain-to-source leakage currentVGS = 0 V, VDS = 32 V1μA
IGSSGate-to-source leakage currentVDS = 0 V, VGS = 20 V100nA
VGS(th)Gate-to-source threshold voltageVDS = VGS, ID = 250 μA1.41.72.3V
RDS(on)Drain-to-source on resistanceVGS = 4.5 V, ID = 100 A2.02.6mΩ
VGS = 10 V, ID = 100 A1.41.7
gfsTransconductanceVDS = 4 V, ID = 100 A330S
DYNAMIC CHARACTERISTICS
CissInput capacitanceVGS = 0 V, VDS = 20 V, ƒ = 1 MHz877011400pF
CossOutput capacitance8321080pF
CrssReverse transfer capacitance424551pF
RGSeries gate resistance0.91.8
QgGate charge total (4.5 V)VDS = 20 V, ID = 100 A5875nC
QgGate charge total (10 V)118153nC
QgdGate charge gate-to-drain21nC
QgsGate charge gate-to-source28nC
Qg(th)Gate charge at Vth15nC
QossOutput chargeVDS = 20 V, VGS = 0 V35nC
td(on)Turnon delay timeVDS = 20 V, VGS = 10 V,
IDS = 100 A, RG = 0 Ω
10ns
trRise time8ns
td(off)Turnoff delay time29ns
tfFall time8ns
DIODE CHARACTERISTICS
VSDDiode forward voltageISD = 100 A, VGS = 0 V0.851.0V
QrrReverse recovery chargeVDS= 20 V, IF = 100 A,
di/dt = 300 A/μs
70nC
trrReverse recovery time41ns