ZHCSVJ2I August   2007  – December 2024 CDCE937 , CDCEL937

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements: CLK_IN
    7. 5.7 Timing Requirements: SDA/SCL
    8. 5.8 EEPROM Specification
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Control Terminal Setting
      2. 7.3.2 Default Device Setting
      3. 7.3.3 SDA/SCL Serial Interface
      4. 7.3.4 Data Protocol
    4. 7.4 Device Functional Modes
      1. 7.4.1 SDA/SCL Hardware Interface
    5. 7.5 Programming
  9. 8 Register Maps
    1. 8.1 SDA/SCL Configuration Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Spread Spectrum Clock (SSC)
        2. 9.2.2.2 PLL Frequency Planning
        3. 9.2.2.3 Crystal Oscillator Start-Up
        4. 9.2.2.4 Frequency Adjustment With Crystal Oscillator Pulling
        5. 9.2.2.5 Unused Inputs and Outputs
        6. 9.2.2.6 Switching Between XO and VCXO Mode
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 第三方产品免责声明
      2. 10.1.2 Development Support
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 接收文档更新通知
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 Revision History

Changes from Revision H (July 2024) to Revision I (October 2024)

  • 添加了相关终端设备链接Go
  • 通篇将“主器件/从器件”实例替换为“控制器/目标”Go
  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • Added information on allowable data inputs during the EEPROM write cycle in Data Protocol Go
  • Renamed SLAVE_ADR to I2C_ADR Go
  • Updated Power Supply Recommendations Go
  • Included EVM User's GuidesGo

Changes from Revision G (October 2016) to Revision H (July 2024)

  • 通篇更新了表格、图和交叉参考的编号格式Go

Changes from Revision F (March 2010) to Revision G (October 2016)

  • 添加了 ESD 等级 表、特性说明 部分、器件功能模式、应用和实施 部分、电源相关建议 部分、布局 部分、器件和文档支持 部分以及机械、封装和可订购信息 部分Go
  • 更改了应用 Go
  • Changed Thermal Resistance Junction to Ambient, RθJA, values in Thermal Information From: 89 (0 lfm), 75 (150 lfm), 74 (200 lfm), 74 (250 lfm), and 69 (500 lfm) To: 89.04Go
  • Deleted Input Capacitance figureGo

Changes from Revision E (October 2009) to Revision F (March 2010)

  • Added PLL settings limits: 16 ≤ q ≤ 63, 0 ≤ p ≤ 7, 0 ≤ r ≤ 511, 0 < N < 4096 foot to PLL1, PLL2, and PLL3 Configure Register TableGo
  • Changed 100MHz < ƒVCO > 200MHz; TO 80MHz ≤ ƒVCO ≤ 230MHz; and changed 0 ≤ p ≤ 7 TO 0 ≤ p ≤ 4Go
  • Changed under Example, fifth row, N", 2 places TO N'Go

Changes from Revision D (September 2009) to Revision E (October 2009)

  • Deleted sentence - A different default setting can be programmed on customer request. Contact Texas Instruments sales or marketing representative for more informationGo

Changes from Revision C (January 2009) to Revision D (September 2009)

  • Added Note 3: SDA and SCL can go up to 3.6V as stated in the Recommended Operating Conditions tableGo

Changes from Revision B (December 2007) to Revision C (January 2009)

  • Changed Generic Configuration Register table SLAVE_ADR default value From: 00b To: 01bGo

Changes from Revision A (September 2007) to Revision B (December 2007)

  • Changed Terminal Functions Table - the pin numbers to correspond with pin outs on the packageGo
  • Added note to PWDN description to Generic Configuration Register tableGo
  • Changed Generic Configuration Register table RID default From: 0h To: XbGo

Changes from Revision * (August 2007) to Revision A (September 2007)

  • 将数据表状态从“产品预发布”更改为“量产数据”Go