ZHCSRI9F August   1997  – April 2021 CD54HC11 , CD74HC11

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
    1.     5
      1.      Pin Functions
  5. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Operating Characteristics
    8. 5.8 Typical Characteristics
  6. Parameter Measurement Information
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 Standard CMOS Inputs
      3. 7.3.3 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
        1.       Power Supply Recommendations
  9. Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 Related Links
    7. 10.7 Community Resources
    8. 10.8 术语表
      1.      Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • J|14
散热焊盘机械数据 (封装 | 引脚)
订购信息

说明

此器件包含三个独立 3 输入与门。每个逻辑门以正逻辑执行布尔函数 Y = A ● B ● C。

器件信息(1)
器件型号封装封装尺寸(标称值)
CD74HC11MSOIC (14)8.70mm × 3.90mm
CD74HC11EPDIP (14)19.30mm × 6.40mm
CD54HC11FCDIP (14)21.30mm × 7.60mm
如需了解所有可用封装,请参阅数据表末尾的可订购产品附录。
GUID-20722692-56B6-48B9-92B8-98CA067EA146-low.gif功能引脚分配