ZHCSEB0D September   2015  – July 2018 CC1310

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能框图
  2. 2修订历史记录
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram – RSM Package
    2. 4.2 Signal Descriptions – RSM Package
    3. 4.3 Pin Diagram – RHB Package
    4. 4.4 Signal Descriptions – RHB Package
    5. 4.5 Pin Diagram – RGZ Package
    6. 4.6 Signal Descriptions – RGZ Package
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
    5. 5.5  RF Characteristics
    6. 5.6  Receive (RX) Parameters, 861 MHz to 1054 MHz
    7. 5.7  Receive (RX) Parameters, 431 MHz to 527 MHz
    8. 5.8  Transmit (TX) Parameters, 861 MHz to 1054 MHz
    9. 5.9  Transmit (TX) Parameters, 431 MHz to 527 MHz
    10. 5.10 PLL Parameters
    11. 5.11 ADC Characteristics
    12. 5.12 Temperature Sensor
    13. 5.13 Battery Monitor
    14. 5.14 Continuous Time Comparator
    15. 5.15 Low-Power Clocked Comparator
    16. 5.16 Programmable Current Source
    17. 5.17 DC Characteristics
    18. 5.18 Thermal Characteristics
    19. 5.19 Timing and Switching Characteristics
      1. 5.19.1 Reset Timing
        1. Table 5-1 Reset Timing
      2. 5.19.2 Wakeup Timing
        1. Table 5-2 Wakeup Timing
      3. 5.19.3 Clock Specifications
        1. Table 5-3 24-MHz Crystal Oscillator (XOSC_HF)
        2. Table 5-4 32.768-kHz Crystal Oscillator (XOSC_LF)
        3. Table 5-5 48-MHz RC Oscillator (RCOSC_HF)
        4. Table 5-6 32-kHz RC Oscillator (RCOSC_LF)
      4. 5.19.4 Flash Memory Characteristics
        1. Table 5-7 Flash Memory Characteristics
      5. 5.19.5 Synchronous Serial Interface (SSI) Characteristics
        1. Table 5-8 Synchronous Serial Interface (SSI) Characteristics
    20. 5.20 Typical Characteristics
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Main CPU
    3. 6.3  RF Core
    4. 6.4  Sensor Controller
    5. 6.5  Memory
    6. 6.6  Debug
    7. 6.7  Power Management
    8. 6.8  Clock Systems
    9. 6.9  General Peripherals and Modules
    10. 6.10 Voltage Supply Domains
    11. 6.11 System Architecture
  7. 7Application, Implementation, and Layout
    1. 7.1 Application Information
    2. 7.2 TI Design or Reference Design
  8. 8器件和文档支持
    1. 8.1  器件命名规则
    2. 8.2  工具和软件
    3. 8.3  文档支持
    4. 8.4  德州仪器 (TI) 低功耗射频网站
    5. 8.5  其他信息
    6. 8.6  社区资源
    7. 8.7  商标
    8. 8.8  静电放电警告
    9. 8.9  出口管制提示
    10. 8.10 术语表
  9. 9机械、封装和可订购信息
    1. 9.1 封装信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4.6 Signal Descriptions – RGZ Package

Table 4-3 Signal Descriptions – RGZ Package

PIN TYPE DESCRIPTION
NAME NO.
DCDC_SW 33 Power Output from internal DC/DC(1)(2)
DCOUPL 23 Power 1.27-V regulated digital-supply (decoupling capacitor)(2)
DIO_1 6 Digital I/O GPIO, Sensor Controller
DIO_2 7 Digital I/O GPIO, Sensor Controller
DIO_3 8 Digital I/O GPIO, Sensor Controller
DIO_4 9 Digital I/O GPIO, Sensor Controller
DIO_5 10 Digital I/O GPIO, Sensor Controller, high-drive capability
DIO_6 11 Digital I/O GPIO, Sensor Controller, high-drive capability
DIO_7 12 Digital I/O GPIO, Sensor Controller, high-drive capability
DIO_8 14 Digital I/O GPIO
DIO_9 15 Digital I/O GPIO
DIO_10 16 Digital I/O GPIO
DIO_11 17 Digital I/O GPIO
DIO_12 18 Digital I/O GPIO
DIO_13 19 Digital I/O GPIO
DIO_14 20 Digital I/O GPIO
DIO_15 21 Digital I/O GPIO
DIO_16 26 Digital I/O GPIO, JTAG_TDO, high-drive capability
DIO_17 27 Digital I/O GPIO, JTAG_TDI, high-drive capability
DIO_18 28 Digital I/O GPIO
DIO_19 29 Digital I/O GPIO
DIO_20 30 Digital I/O GPIO
DIO_21 31 Digital I/O GPIO
DIO_22 32 Digital I/O GPIO
DIO_23 36 Digital or analog I/O GPIO, Sensor Controller, analog
DIO_24 37 Digital or analog I/O GPIO, Sensor Controller, analog
DIO_25 38 Digital or analog I/O GPIO, Sensor Controller, analog
DIO_26 39 Digital or analog I/O GPIO, Sensor Controller, analog
DIO_27 40 Digital or analog I/O GPIO, Sensor Controller, analog
DIO_28 41 Digital or analog I/O GPIO, Sensor Controller, analog
DIO_29 42 Digital or analog I/O GPIO, Sensor Controller, analog
DIO_30 43 Digital or analog I/O GPIO, Sensor Controller, analog
EGP – Power Ground; exposed ground pad
JTAG_TMSC 24 Digital I/O JTAG TMSC, high-drive capability
JTAG_TCKC 25 Digital I/O JTAG TCKC(3)
RESET_N 35 Digital input Reset, active-low. No internal pullup.
RF_N 2 RF I/O Negative RF input signal to LNA during RX
Negative RF output signal from PA during TX
RF_P 1 RF I/O Positive RF input signal to LNA during RX
Positive RF output signal from PA during TX
VDDR 45 Power 1.7-V to 1.95-V supply, connect to output of internal DC/DC(2)(4)
VDDR_RF 48 Power 1.7-V to 1.95-V supply, connect to output of internal DC/DC(2)(5)
VDDS 44 Power 1.8-V to 3.8-V main chip supply(1)
VDDS2 13 Power 1.8-V to 3.8-V DIO supply(1)
VDDS3 22 Power 1.8-V to 3.8-V DIO supply(1)
VDDS_DCDC 34 Power 1.8-V to 3.8-V DC/DC supply
X24M_N 46 Analog I/O 24-MHz crystal oscillator pin 1
X24M_P 47 Analog I/O 24-MHz crystal oscillator pin 2
RX_TX 3 RF I/O Optional bias pin for the RF LNA
X32K_Q1 4 Analog I/O 32-kHz crystal oscillator pin 1
X32K_Q2 5 Analog I/O 32-kHz crystal oscillator pin 2
(1) See technical reference manual listed in Section 8.3 for more details.
(2) Do not supply external circuitry from this pin.
(3) For design consideration regrading noise immunity for this pin, see the JTAG Interface chapter in the CC13x0, CC26x0 SimpleLink™ Wireless MCU Technical Reference Manual.
(4) If internal DC/DC is not used, this pin is supplied internally from the main LDO.
(5) If internal DC/DC is not used, this pin must be connected to VDDR for supply from the main LDO.