SWRS112H June   2011  – July 2015 CC1120


  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Diagram
    2. 3.2 Pin Configuration
  4. 4Specifications
    1. 4.1  ESD Ratings
    2. 4.2  Recommended Operating Conditions (General Characteristics)
    3. 4.3  RF Characteristics
    4. 4.4  Power Consumption Summary
    5. 4.5  Receive Parameters
    6. 4.6  Transmit Parameters
    7. 4.7  PLL Parameters
    8. 4.8  32-MHz Clock Input (TCXO)
    9. 4.9  32-MHz Crystal Oscillator
    10. 4.10 32-kHz Clock Input
    11. 4.11 32-kHz RC Oscillator
    12. 4.12 I/O and Reset
    13. 4.13 Temperature Sensor
    14. 4.14 Thermal Resistance Characteristics for RHB Package
    15. 4.15 Timing Requirements
    16. 4.16 Regulatory Standards
    17. 4.17 Typical Characteristics
  5. 5Detailed Description
    1. 5.1 Block Diagram
    2. 5.2 Frequency Synthesizer
    3. 5.3 Receiver
    4. 5.4 Transmitter
    5. 5.5 Radio Control and User Interface
    6. 5.6 Enhanced Wake-On-Radio (eWOR)
    7. 5.7 Sniff Mode
    8. 5.8 Antenna Diversity
    9. 5.9 WaveMatch
  6. 6Application, Implementation, and Layout
    1. 6.1 Application Information
      1. 6.1.1 Typical Application Circuit
      2. 6.1.2 TI Reference Designs
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Development Support
        1. Configuration Software
      2. 7.1.2 Device and Development-Support Tool Nomenclature
    2. 7.2 Documentation Support
      1. 7.2.1 Community Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  8. 8Mechanical Packaging and Orderable Information


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散热焊盘机械数据 (封装 | 引脚)

7 Device and Documentation Support

7.1 Device Support

7.1.1 Development Support Configuration Software

The CC1120 device can be configured using the SmartRF Studio software (SWRC046). The SmartRF Studio software is highly recommended for obtaining optimum register settings, and for evaluating performance and functionality.

7.1.2 Device and Development-Support Tool Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all microprocessors (MPUs) and support tools. Each device has one of three prefixes: X, P, or null (no prefix) (for example, CC1120). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMDX) through fully qualified production devices and tools (TMDS).

Device development evolutionary flow:

    XExperimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    PPrototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    nullProduction version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

    TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing.
    TMDS Fully qualified development-support product.

X and P devices and TMDX development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, RHB) and the temperature range (for example, blank is the default commercial temperature range) provides a legend for reading the complete device name for any CC1120 device.

For orderable part numbers of CC1120 devices in the QFN package types, see the Package Option Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative.

7.2 Documentation Support

The following documents supplement the CC1120 transceiver. Copies of these documents are available on the Internet at www.ti.com. Tip: Enter the literature number in the search box provided at www.ti.com.

    SWRU295CC112X/CC1175 Low-Power High Performance Sub-1 GHz RF Transceivers/Transmitter User's Guide
    SWRA398Using the CC112x/CC1175 at 274 to 320 MHz
    SWRA428CC112x/CC120x Sniff Mode Application Note
    SWRZ039CC112x, CC1175 Silicon Errata
    SWRR106CC112x IPC 868- and 915-MHz 2-layer Reference Design
    SWRR107CC112x IPC 868- and 915-MHz 4-layer Reference Design
    SWRC220CC1120EM 169-MHz Reference Design
    SWRC221CC1120EM 420- to 470-MHz Reference Design
    SWRC222CC1120EM 868- to 915-MHz Reference Design

7.2.1 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

7.3 Trademarks

SmartRF, E2E are trademarks of Texas Instruments.

7.4 Electrostatic Discharge Caution


This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

7.5 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.