ZHCSAX2F July   2012  – June 2017

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Device Options
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
      1. 8.1.1 A Brief Description of the Wireless System
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Using the bq5105x as a Wireless Li-Ion/Li-Pol Battery Charger (With Reference to )
      2. 8.3.2 Details of a Qi Wireless Power System and bq5105xB Power Transfer Flow Diagrams
      3. 8.3.3 Battery Charge Profile
      4. 8.3.4 Battery Charging Process
        1. 8.3.4.1  Precharge Mode (VBAT ≤ VLOWV)
        2. 8.3.4.2  Fast Charge Mode / Constant Voltage Mode
        3. 8.3.4.3  Battery Charge Current Setting Calculations
          1. 8.3.4.3.1 RILIM Calculations
          2. 8.3.4.3.2 Termination Calculations
        4. 8.3.4.4  Battery-Charger Safety and JEITA Guidelines
          1. 8.3.4.4.1 bq51050B and bq51051B JEITA
          2. 8.3.4.4.2 bq51052B Modified JEITA
        5. 8.3.4.5  Input Overvoltage
        6. 8.3.4.6  End Power Transfer Packet (WPC Header 0x02)
        7. 8.3.4.7  Status Output
        8. 8.3.4.8  Communication Modulator
        9. 8.3.4.9  Adaptive Communication Limit
        10. 8.3.4.10 Synchronous Rectification
        11. 8.3.4.11 Internal Temperature Sense (TS Function of the TS/CTRL Pin)
          1. 8.3.4.11.1 TS/CTRL Function
          2. 8.3.4.11.2 Thermal Protection
        12. 8.3.4.12 WPC v1.2 Compatibility
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 bq51050B Used as a Wireless Power Receiver and Li-Ion/Li-Pol Battery Charger
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Series and Parallel Resonant Capacitor Selection
          2. 9.2.1.2.2 COMM, CLAMP and BOOT Capacitors
          3. 9.2.1.2.3 Charging and Termination Current
          4. 9.2.1.2.4 Adapter Enable
          5. 9.2.1.2.5 Charge Indication and Power Capacitors
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Application for Wired Charging
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Blocking Back-Back FET
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 相关链接
    3. 12.3 接收文档更新通知
    4. 12.4 社区资源
    5. 12.5 商标
    6. 12.6 静电放电警告
    7. 12.7 Glossary
  13. 13机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RHL|20
  • YFP|28
散热焊盘机械数据 (封装 | 引脚)
订购信息

Layout

Layout Guidelines

  • Keep the trace resistance as low as possible on AC1, AC2, and BAT.
  • Detection and resonant capacitors need to be as close to the device as possible.
  • COMM, CLAMP, and BOOT capacitors need to be placed as close to the device as possible.
  • Via interconnect on PGND net is critical for appropriate signal integrity and proper thermal performance.
  • High frequency bypass capacitors need to be placed close to RECT and OUT pins.
  • ILIM and FOD resistors are important signal paths and the loops in those paths to PGND must be minimized.
  • For the RHL package, connect the thermal pad to ground to help dissipate heat.
  • Signal and sensing traces are the most sensitive to noise; the sensing signal amplitudes are usually measured in mV, which is comparable to the noise amplitude. Make sure that these traces are not being interfered by the noisy and power traces. AC1, AC2, BOOT1, BOOT2, COMM1, and COMM2 are the main source of noise in the board. These traces should be shielded from other components in the board. It is usually preferred to have a ground copper area placed underneath these traces to provide additional shielding. Also, make sure they do not interfere with the signal and sensing traces. The PCB should have a ground plane (return) connected directly to the return of all components through vias (two vias per capacitor for power-stage capacitors, one via per capacitor for small-signal components).

    For a 1-A fast charge current application, the current rating for each net is as follows:

    • AC1 = AC2 = 1.2 A
    • OUT = 1 A
    • RECT = 100 mA (RMS)
    • COMMx = 300 mA
    • CLAMPx = 500 mA
    • All others can be rated for 10 mA or less

Layout Example

bq51050B bq51051B bq51052B Layout.gif Figure 38. bq5105x Layout Example